Measuring Device On-Site Electronics High-Temperature Connection
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Solution Overview
Problem
Conventional measuring devices face challenges with high-temperature compatibility due to the limitations of conventional plugs, which are designed for temperatures up to 100°C, whereas measuring devices often operate in environments exceeding 150°C, and the difficulty in connecting small on-site electronics components.
Innovation Solution
The measuring device eliminates the need for intermediate plugs by directly connecting the circuit board with the on-site electronics using multiple metallized contact areas, allowing for soldered connections that can withstand high temperatures, and is manufactured using a System-in-Package method to match thermal expansion coefficients, with a flexible circuit board providing energy supply and signal processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional plugs are used to connect on-site electronics, then the connection is easy to manufacture, but the device cannot withstand temperatures above 100°C
Solution Approach 1:
The patent removes the conventional plug from the connection path between the sensor element and circuit board. By directly integrating the on-site electronics onto the circuit board without an intermediate plug component, the design eliminates the temperature limitation of conventional plugs while simplifying the overall connection structure.
Solution Approach 2:
The patent changes the connection method from mechanical plug-in to direct soldered connection, which allows the system to withstand higher temperatures. The soldered joints and metallized surfaces are designed to maintain electrical and mechanical connection stability at temperatures up to 150°C, fundamentally changing the thermal performance parameter of the connection.
2Volume of moving object
If the on-site electronics is made small to reduce size, then the device compactness is improved, but the plug becomes difficult to interact with
Solution Approach 1:
By removing the plug entirely and implementing direct mounting of the on-site electronics onto the circuit board, the patent eliminates the accessibility issue of small plugs. The compact on-site electronics can be directly soldered to the circuit board, maintaining ease of assembly despite the reduced size of the electronic component.
3Reliability
If System-in-Package method is used to match thermal expansion coefficients, then thermomechanical stress is reduced, but the manufacturing process becomes more demanding
Solution Approach 1:
The patent applies the System-in-Package method specifically to the on-site electronics housing, creating a localized thermal expansion match between the sensor element and electronics. This targeted approach to thermal management in the critical connection region provides thermomechanical stability without requiring the entire device to undergo complex manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables measuring devices to operate effectively in temperatures up to 150°C without thermomechanical stress and hysteresis, providing reliable performance and adaptability to customer requirements.
Implementation Method 1
wherein the on-site electronics is mechanically and electrically connected with the sensor element by means of the first contact areas and the at least one metallized surface section
Implementation Method 2
The circuit board is mechanically and electrically connected with the on-site electronics by means of the second contact areas and the third contact areas
Implementation Method 3
the coefficients of thermal expansion of the pressure sensor element and the on-site electronics are to be matched to one another, since otherwise thermomechanical stress and hysteresis in the pressure sensor element can easily occur
Data Source
AI summary
A measuring device for determining a physical and/or chemical measured variable comprises a sensor element having an electrical transducer for providing measured variable dependent electrical, primary signals and a sensor body having at least one metallized surface section; an on- site electronics, wherein a first area of the on-site electronics includes a plurality of first contact areas that are mechanically and electrically connected with the at least one metallized surface section of the sensor element, wherein a second area of the on-site electronics includes a plurality of second contact areas; and a circuit board that includes a plurality of third contact areas in a first region, wherein the circuit board is mechanically and electrically connected with the on-site electronics by means of the second contact areas and the third contact areas.