MEC Server Passive Cooling Layout for High-Power Edge Computing
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Solution Overview
Problem
Conventional edge servers face limitations in meeting demand requirements of networks, particularly in terms of computing power, reliability, and environmental adaptability, while also being costly and inefficient in heat dissipation.
Innovation Solution
A mobile edge computing (MEC) server device with a scalable processor, passive thermal cooling arrangement, and integrated components like Ethernet controllers and a graphic processor unit, utilizing heat pipes and cooling blocks to distribute heat over aluminum fins, enabling efficient heat dissipation and high computing power in harsh environments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If conventional edge servers are used, then basic computing functions are provided, but computing power and reliability are insufficient to meet network demand requirements
Solution Approach 1:
The server is divided into multiple functional modules including processing units, storage units, and cooling units that can independently operate and scale. The modular architecture allows each component to be optimized for its specific function while maintaining overall system reliability and computing power.
Solution Approach 2:
The patent introduces a passive thermal cooling arrangement with heat pipes and cooling blocks that operates in a different dimensional space from conventional active cooling systems. This multi-dimensional approach to thermal management enables higher computing power while maintaining reliability through efficient heat dissipation.
2Speed
If high-power processing units are used, then computing speed is improved, but heat dissipation efficiency becomes insufficient
Solution Approach 1:
Heat pipes serve as intermediary thermal conduction elements between the processing units and the cooling blocks. These heat pipes efficiently transfer heat from high-power processors to cooling structures, enabling high processing speeds while maintaining effective heat dissipation through the intermediary thermal management system.
Solution Approach 2:
The passive cooling system utilizes phase transition principles in heat pipe technology, where the working fluid undergoes phase changes to transfer heat efficiently. This phase transition mechanism enables effective heat dissipation from high-power processing units without requiring active cooling systems.
3Temperature
If active cooling systems are used, then heat dissipation is effective, but device complexity and power consumption increase
Solution Approach 1:
The passive thermal cooling arrangement operates autonomously without requiring external power sources or active control mechanisms. The heat pipes and cooling blocks automatically dissipate heat through natural conduction and phase transition processes, eliminating the complexity of active cooling systems while maintaining effective temperature management.
4Adaptability or versatility
If conventional server architectures are used, then basic functionality is provided, but adaptability to harsh environments is insufficient
Solution Approach 1:
The passive cooling system provides beforehand protection against thermal stress in harsh environments. By continuously dissipating heat through heat pipes and cooling blocks, the system pre-cools critical components before extreme temperatures can cause damage, ensuring operational reliability in harsh conditions without requiring complex environmental shielding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The MEC server provides high processing speed, reliability, and adaptability to harsh conditions with minimal maintenance, supporting 5G/6G use cases and enhancing user experience through efficient heat management and reduced power consumption.
Implementation Method 1
heat is distributed in the plurality of fins through the plurality of cooling blocks and the plurality of windpipes
Implementation Method 2
passive thermal cooling arrangement configured to have amb−50 C, 0.5 m/s air velocity
Data Source
AI summary
Disclosed is a Mobile Edge Computing (MEC) server device (100) and use of method thereof. Proposed design of the MEC server device (100) works with a 5G network for edge computing and analysis. The proposed server device (100) has multiple elements integrated on a single board and uses a passive thermal cooling approach. The proposed MEC server device (100) enables equal heat dissipation. Further, the device has a high processing speed and computing functionality.