Embedded MECA Module Isolation for Thermal Cross-Talk
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Solution Overview
Problem
Existing electronic assemblies with integrated microelectronic components experience thermal cross-talk between chips, which negatively affect the performance of lower power chips due to heat dissipation from higher power chips.
Innovation Solution
Incorporating a low-thermal-conductivity barrier or spacer between chips held by a heat-conducting attachment material in a through-wafer cavity, which thermally isolates the chips while maintaining efficient heat dissipation through the metal attachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If chips are held by heat-conducting attachment material in a through-wafer cavity, then heat dissipation is improved, but thermal cross-talk between chips increases
Solution Approach 1:
The through-wafer cavity is segmented into multiple isolated sub-cavities, each containing a chip. The cavity walls act as thermal barriers that separate the heat dissipation paths of adjacent chips, allowing each chip to dissipate heat independently through its own cavity while preventing thermal cross-talk between neighboring chips.
Solution Approach 2:
The cavity walls serve as intermediary thermal barriers between adjacent chips. These walls are positioned between chips that require thermal isolation, blocking the direct thermal coupling that would otherwise occur through the heat-conducting attachment material, thus mediating the thermal interaction between chips.
2Adaptability or versatility
If multiple chips are assembled in a single through-wafer cavity, then device integration is improved, but thermal isolation between chips deteriorates
Solution Approach 1:
The single through-wafer cavity is divided into multiple isolated compartments or sub-cavities by internal walls. Each sub-cavity houses a chip and provides thermal isolation, while the overall structure remains integrated as a single wafer-level package, achieving both high integration and thermal isolation.
Solution Approach 2:
Multiple isolated chip cavities are nested within the single through-wafer cavity structure. Each chip resides in its own nested sub-cavity, allowing multiple chips to be integrated in a compact arrangement while maintaining thermal isolation through the nested cavity walls.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly reduces thermal cross-talk, allowing higher power chips to operate efficiently without overheating adjacent lower power chips, enhancing performance and reliability.
Implementation Method 1
a heat conducting attachment material that fills at least a portion of the through-wafer cavity
Implementation Method 2
a barrier having a heat conductivity lower than a heat conductivity of the carrier wafer is held by the heat conducting attachment material in the through-wafer cavity between the first and second component chips
Data Source
AI summary
An electronic assembly, having a carrier wafer with a top wafer surface and a bottom wafer surface; an electronic integrated circuit being formed in the carrier wafer and comprising first and second integrated circuit contact pads; said carrier wafer comprising a through-wafer cavity having walls that join said top wafer surface to said bottom wafer surface; first and second component chips held in said through-wafer cavity each by direct contact of at least a side surface of said first and second component chips with a heat conducting attachment material that fills said through-wafer cavity; said first and second component chips comprising respectively at least a first and a second component contact pads; a barrier having a heat conductivity lower than a heat conductivity of said carrier wafer held by said heat conducting attachment material in said through-wafer cavity between said first and said second component chips.