Mechanical Brace with Soft Layer for IC Package Warpage
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The increasing density of input/output (I/O) pads on integrated circuit dies due to smaller package sizes and more integrated functions poses challenges in die packaging, particularly in achieving uniform pressure distribution and thermal dissipation during the assembly of system-on-wafer assemblies.
Innovation Solution
A mechanical brace with a rigid layer and a soft layer is used to clamp the package structure between a thermal module and the mechanical brace, where the soft layer conforms to underlying features, ensuring uniform pressure distribution and improved thermal dissipation by reducing warpage and enhancing the mechanical support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If integrated circuit dies are made smaller with higher I/O pad density, then the number of I/O pads increases, but the area available for I/O pads decreases
Solution Approach 1:
The patent implements fan-out packaging that redistributes I/O pads from the die surface to the package bottom surface, effectively moving the I/O pad layout from a two-dimensional constraint on the die to a three-dimensional redistribution across multiple surfaces. This allows the package to accommodate more I/O pads than the original die area would permit.
2Volume of moving object
If package size is reduced to improve integration, then the density of I/O pads increases, but uniform pressure distribution during assembly becomes more difficult
Solution Approach 1:
The patent introduces a compliant underfill material with specific viscoelastic properties that locally adapts to the package structure, providing differential support zones that ensure uniform pressure distribution across the die attach interface despite variations in package geometry and assembly forces.
Solution Approach 2:
The patent employs a composite packaging structure combining rigid package substrates with a compliant underfill material that has intermediate mechanical properties. This composite approach allows the structure to maintain structural integrity while distributing assembly pressures uniformly across the I/O pad interface.
3Quantity of substance
If I/O pad density is increased on smaller dies, then more functions are integrated, but thermal dissipation becomes more challenging
Solution Approach 1:
The patent introduces a thermally conductive underfill material that acts as an intermediary thermal pathway between the high-density I/O pads and the package substrate heat sinks. This intermediary layer efficiently conducts heat away from the dense I/O pad regions, preventing thermal accumulation despite the increased power density from more integrated functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves thermal dissipation and reduces warpage in system-on-wafer assemblies by ensuring uniform pressure distribution across the thermal interface material, thereby optimizing the performance of integrated circuit packages.
Implementation Method 1
the soft layer conforms to underlying features, ensuring uniform pressure distribution
Implementation Method 2
A mechanical brace with a rigid layer and a soft layer is used to clamp the package structure between a thermal module and the mechanical brace
Data Source
AI summary
In an embodiment, a device includes: a package component including integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure over the encapsulant and the integrated circuit dies, and sockets over the redistribution structure; a mechanical brace physically coupled to the sockets, the mechanical brace having openings, each one of the openings exposing a respective one of the sockets; a thermal module physically and thermally coupled to the encapsulant and the integrated circuit dies; and bolts extending through the thermal module, the mechanical brace, and the package component.