Mechanical Clamping Conveying for Substrate Evaporation
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Solution Overview
Problem
Inline type evaporation apparatuses face challenges in conveying and aligning large substrates due to weight and bending, leading to difficulties in maintaining thickness uniformity and high defect rates from particle deposition during the evaporation process, particularly with electrostatic and adhesive fastening methods which can damage the substrate.
Innovation Solution
A conveying device with a mechanical fastening mechanism using slidable components and a lifting mechanism with through holes to securely hold the substrate without causing damage, allowing for easy receipt and detachment, and flipping the substrate to direct the film evaporating surface downwards for uniform evaporation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrostatic fastening is used to hold the substrate, then the substrate can be securely held during conveying, but the TFT on the substrate tends to be damaged
Solution Approach 1:
The patent replaces electrostatic fastening with a mechanical fastening system consisting of a clamping mechanism that physically夹持s the substrate edges. This mechanical approach avoids the harmful electrostatic fields that damage TFTs while providing reliable substrate holding during conveying and evaporation processes
2Reliability
If adhesive fastening is used to hold the substrate, then the substrate can be securely held, but it is difficult to control the adhesion strength and causes difficulty in subsequent detaching
Solution Approach 1:
The patent employs a dynamic mechanical clamping system where the clamping force can be adjusted and released. The clamping mechanism allows easy detachment by releasing the mechanical constraint, avoiding the permanent bonding issues of adhesive fastening while maintaining secure holding during the process
3Reliability
If the substrate is conveyed in upright posture to overcome weight and bending, then the substrate can be supported, but particles are prone to deposit on the film evaporating surface
Solution Approach 1:
The patent inverts the substrate orientation during conveying, placing the film evaporating surface facing downward instead of upward. This inversion prevents particles from settling on the evaporating surface while the mechanical fastening system supports the substrate weight and prevents bending in this inverted configuration
4Reliability
If a linear heating source is placed in upright posture to match the substrate, then the substrate can be conveyed upright, but it increases the difficulty in controlling the heating source to maintain thickness uniformity
Solution Approach 1:
The patent inverts both the substrate and the linear heating source to a horizontal posture. This allows the heating source to be easily controlled for uniform heat distribution across the substrate while the mechanical fastening system maintains substrate stability during the horizontal conveying and evaporation process
Data Source
AI summary
A conveying device, a conveying method, and an evaporation apparatus are provided. The conveying device comprises a carrying mechanism for carrying a substrate; and a fastening mechanism for fastening the substrate on the carrying mechanism in a mechanical manner. In the conveying device, the substrate is fastened on the carrying mechanism in a mechanical manner by the fastening mechanism. As compared with electrostatic fastening and adhesive fastening, this reduces damage to the substrate, increases the reliability for fastening the substrate, and makes it easy to receive and detach the substrate.