Mechanical Seal Cooling Device with Spring-Loaded Heat Absorber

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Solution Overview

Problem

Mechanical seals in centrifugal pumps face challenges in heat dissipation due to friction, leading to localized thermal expansion issues that complicate the integration of cooling devices, particularly in areas where installation space is limited and thermal expansion differences between components can disrupt heat transfer.

Innovation Solution

A mechanical seal design featuring a cooling device with a thermally conductive foil spring area for continuous heat absorption and dissipation, where the heat absorption area is directly in contact with the stationary ring, and spring elements ensure constant pressure, minimizing thermal expansion differences and enhancing cooling efficiency through optimized material selection and geometric design.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a cooling device is integrated directly onto the sealing ring, then cooling efficiency is improved, but thermal expansion differences between components disrupt heat transfer

Engineering Contradiction:
Improvecooling efficiencyVSAvoidheat transfer stability
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The patent applies parameter changes by using spring elements to dynamically adjust the contact pressure between the cooling device and the sealing ring. As thermal expansion occurs, the spring elements automatically adapt their force to maintain optimal thermal contact, compensating for dimensional changes and ensuring stable heat transfer throughout operation.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent introduces spring elements as intermediary components between the cooling device and the sealing ring. These spring elements act as a buffer that accommodates thermal expansion differences while maintaining continuous contact, thereby mediating the thermal connection and preventing disruption of heat transfer due to dimensional changes.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Temperature

If cooling ribs are provided to increase surface area, then heat dissipation is improved, but device complexity increases

Engineering Contradiction:
Improveheat dissipationVSAvoidstructural complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent applies local quality by providing cooling ribs only in specific areas where heat generation is most intense. Rather than uniformly increasing surface area throughout the entire sealing ring, the cooling features are strategically placed at critical thermal zones, thereby improving heat dissipation where needed while minimizing overall structural complexity.

Inventive Principle:
Principle #3Local quality

3Temperature

If the heat absorption area is pressed against the second ring with constant force, then thermal contact is improved, but the spring elements must accommodate thermal expansion

Engineering Contradiction:
Improvethermal contactVSAvoidspring element design
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent applies dynamics by using spring elements instead of rigid connections between the cooling device and the sealing ring. The spring elements provide a dynamic, adaptable connection that automatically adjusts to thermal expansion and contraction, maintaining constant thermal contact pressure without requiring complex adjustment mechanisms or pre-calculated dimensional compensations.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design ensures reliable and efficient cooling of the sealing arrangement by maintaining consistent contact and reducing thermal stresses, allowing for effective heat dissipation even under expansion, thereby protecting the sealing integrity and improving the mechanical seal's performance.

Implementation Method 1

spring elements with at least two transfer points, which permanently press the heat absorption against the second ring

Methodology Applied
Scientific EffectElasticity: Elasticity

Implementation Method 2

The spring area is formed by a thermally conductive foil. This brings both good thermal conductivity and a sufficient spring effect.

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

the cooling device provides a first area for heat absorption, which is in direct contact with the second ring

Methodology Applied
Scientific EffectHeat absorption: Absorption (physical)

Implementation Method 4

a second area for heat dissipation

Methodology Applied
Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentEP3036464B1Seal arrangement with a cooling device
Publication Date: 2019.07.24 KSB SE & CO KGAA
  • EP3036464B1 patent drawingFigure 1

AI summary

Sealing arrangement, in particular a mechanical seal, wherein the sealing arrangement comprises a first rotating ring (1) and a second fixed ring (2) which are pressed against one another by means of a force, wherein a sealing surface (3) is formed between the first and the second ring (1, 2), wherein a cooling device is provided on the second fixed ring (2), wherein the cooling device has a first region for absorbing heat (4), which is in direct contact with the second ring (2), and a second region for dissipating heat (5), and also spring elements (6) with two transfer points (7) which permanently press the heat absorber (4) against the second ring (2).