Mechanical Vacuum Valve Layout for Low Run-Out Substrate Holders
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Solution Overview
Problem
The complexity and heat-related errors in substrate holder devices used for bonding substrates in microelectronics and microsystems technology lead to increased run-out and reduced quality due to the need for multiple individually controlled vacuum paths and valves, which complicates the bonding process and limits the achievable lateral density of functional units.
Innovation Solution
A substrate holder device with a mechanical control valve that regulates multiple openings, reducing the number of components and heat input, allowing for controlled fixation and release of substrates with minimal run-out by influencing the bonding wave's shape and propagation speed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If multiple individually controlled vacuum paths and valves are used in substrate holder devices, then the ability to control substrate fixation and release is improved, but the device complexity and heat-related errors increase
Solution Approach 1:
The patent combines multiple vacuum paths into a single integrated vacuum system with one or two vacuum sources. The substrate holder includes multiple vacuum chambers that share common vacuum supply and exhaust paths, eliminating the need for multiple independent vacuum valves. This merging approach maintains the ability to control substrate fixation and release while significantly reducing device complexity and heat-related errors.
2Ease of operation
If multiple individually controlled vacuum paths and valves are used in substrate holder devices, then the ability to control substrate fixation and release is improved, but heat input and run-out increase
Solution Approach 1:
The patent merges multiple vacuum control functions into a single vacuum system architecture. By using one or two vacuum sources shared across multiple chambers and eliminating individual vacuum valves for each path, the system reduces the total number of heated components. This directly reduces heat input to the substrate holder and minimizes thermal run-out during substrate bonding operations.
3Adaptability or versatility
If multiple individually controlled vacuum paths are used, then selective substrate release is improved, but the susceptibility to errors in the bonding process increases
Solution Approach 1:
The patent segments the substrate holder into multiple independent vacuum chambers that can be individually controlled through a shared vacuum system. Each chamber can be independently vented or maintained under vacuum, enabling selective substrate release at different locations and times. This segmentation approach provides the adaptability of multiple controlled paths while using a simplified common vacuum infrastructure that reduces error susceptibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the quality of the bond connection, reduces the susceptibility to errors, and increases the efficiency of the bonding process by minimizing heat input and run-out, thereby improving the precision and effectiveness of substrate bonding.
Implementation Method 1
a vacuum acting through the at least one connection or acting pressure can be provided at the at least two connecting openings in the region of the substrate holder surface
Implementation Method 2
Prebonding processes are processes in which two substrates are bonded together solely through van der Waals forces
Implementation Method 3
Fusion bonding is the process of permanently joining two substrates through the formation of covalent bonds
Data Source
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AI summary
The invention relates to a substrate holder device at least comprising at least one control valve and at least one substrate holder having a substrate holder surface and a substrate holder back surface. The invention also relates to a bonding device and to a method for bonding.