Media Shield EMI Capability Pressure Sensor

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Solution Overview

Problem

Conventional packaged pressure sensor devices are vulnerable to media contamination and electromagnetic interference (EMI), as the gel used to protect the pressure sensor can diffuse media contaminants and expose electronic components to corrosion, and lacks effective EMI shielding.

Innovation Solution

A media shield formed from a sputtered metal layer is implemented on the polymeric gel, minimizing direct media contact and providing EMI protection by being grounded through a vertical wire bond connection, ensuring both media and EMI shielding while maintaining flexibility to transmit pressure effectively.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If the gel is exposed to the environment to transmit pressure, then pressure transmission is enabled, but media contaminants can diffuse through the gel and cause corrosion to electronic components

Engineering Contradiction:
Improvepressure transmissionVSAvoidmedia contamination
Core Design Contradiction:
Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The patent divides the protective function into two separate components: the gel for pressure transmission and the media shield for contamination protection. This segmentation allows each component to perform its specific function optimally without compromising the other.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The media shield acts as an intermediary barrier between the gel and the external environment. It selectively blocks harmful media contaminants while allowing pressure to pass through to the gel, thus protecting the gel without interfering with its pressure transmission function.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If a media shield is added to protect from contamination, then corrosion protection is improved, but device complexity increases

Engineering Contradiction:
Improvecorrosion protectionVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The media shield is implemented as a thin film or coating applied directly to the gel surface. This approach provides effective media protection while minimizing the addition of bulk material and structural complexity. The thin film nature allows pressure to transmit through effectively while blocking contaminant diffusion.

Inventive Principle:
Principle #30Flexible shells and thin films

3Object-affected harmful factors

If the media shield is made from a sputtered metal layer, then EMI shielding capability is provided, but manufacturing complexity increases

Engineering Contradiction:
ImproveEMI protectionVSAvoidmanufacturing process
Core Design Contradiction:
Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The patent combines multiple functions into a single media shield component: media contamination barrier, pressure transmission medium, and EMI shield. The sputtered metal layer is applied during the same manufacturing process as the gel encapsulation, merging the protection functions without requiring separate manufacturing steps for each protective feature.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The media shield utilizes a composite structure combining the polymeric gel matrix with a sputtered metal layer. This composite material provides both the flexibility and pressure transmission properties of the gel while adding the EMI shielding and enhanced media protection properties of the metal layer.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution significantly reduces the risk of corrosion and damage from media contaminants and provides effective EMI shielding, enhancing the reliability and longevity of the pressure sensor device.

Implementation Method 1

the media shield may be connected to ground to further provide EMI shielding

Methodology Applied
Scientific EffectElectromagnetic shielding: Faraday Cage

Implementation Method 2

A media shield formed from a sputtered metal layer is implemented on the polymeric gel

Methodology Applied
Scientific EffectSputtering: Sputtering

Data Source

PatentUS10892229B2Media shield with EMI capability for pressure sensor
Publication Date: 2021.01.12 STMICROELECTRONICS INT NV
  • US10892229B2 patent drawing
  • US10892229B2 patent drawing
  • US10892229B2 patent drawing

AI summary

Embodiments for a packaged semiconductor device and methods of making are provided herein, where a packaged semiconductor device includes a package body having a recess in which a pressure sensor is located; a polymeric gel within the recess that vertically and laterally surrounds the pressure sensor; and a media shield including at least one metal layer on a top surface of the polymeric gel, wherein the media shield and the polymeric gel are sufficiently flexible to transmit pressure to the pressure sensor.