Medical Instruments Fabricated via Semiconductor Lithography and Etching
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Solution Overview
Problem
Current medical instruments lack precision, consistency, and versatility, particularly in micro-surgeries, due to limitations in manufacturing techniques such as grinding and anisotropic etching, which result in imperfections and inability to produce complex blade shapes and bevel angles, leading to tissue tearing and restricted functionality.
Innovation Solution
Employing advanced semiconductor processing technologies like thin film deposition, lithography, etching, and chemical mechanical polishing to fabricate medical instruments with controlled features, high precision, and integrated functionalities, enabling the creation of instruments with varied profiles and configurations at lower costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional grinding methods are used to manufacture surgical blades, then manufacturing cost is reduced, but blade edge sharpness consistency deteriorates and imperfections are introduced
Solution Approach 1:
The patent replaces conventional mechanical grinding methods with electrochemical polishing to manufacture surgical blades. This substitution eliminates mechanical contact that causes edge imperfections and inconsistency, achieving superior sharpness and uniformity without significantly increasing manufacturing cost.
Solution Approach 2:
The patent changes the manufacturing process parameters by using electrochemical polishing instead of mechanical grinding. This process control method allows precise adjustment of polishing conditions (electrical current, chemical solution composition, polishing duration) to achieve consistent blade edge sharpness across all manufactured blades.
2Manufacturing precision
If electrochemical polishing is used to manufacture surgical blades, then blade edge sharpness consistency is improved, but surface imperfections from corrosion remain
Solution Approach 1:
The patent replaces electrochemical polishing with ultrasonic vibration-assisted mechanical polishing. This new mechanical process uses high-frequency vibrations to remove material without the corrosive chemical actions that cause surface imperfections, while still achieving consistent sharp edge geometry.
Solution Approach 2:
The patent employs a composite approach combining ultrasonic vibration with abrasive materials to achieve superior surface quality. The vibration-assisted polishing process integrates mechanical removal with controlled material interaction, eliminating corrosion-related defects while maintaining edge precision.
3Manufacturing precision
If anisotropic etching of silicon is used to create blade edges, then sharp cutting edge is achieved, but blade shape flexibility is restricted to fixed crystallographic angles
Solution Approach 1:
The patent replaces anisotropic etching with ultrasonic vibration-assisted mechanical polishing and forming processes. These methods are not constrained by crystallographic directions, allowing creation of blades with any desired angle or shape configuration while maintaining sharp cutting edges.
Solution Approach 2:
The patent introduces dynamic, adjustable blade configurations that can be customized for different surgical applications. The manufacturing process allows continuous variation of blade angles and shapes rather than being limited to fixed crystallographic orientations, providing adaptability for various surgical needs.
4Device complexity
If conventional mechanical surgical instruments are used, then single functionality is provided, but integration with other devices is limited
Solution Approach 1:
The patent creates surgical instruments with multiple integrated functions, combining cutting, sensing, and actuation capabilities in single devices. The ultrasonic vibration technology serves both as a manufacturing method and as an operational mechanism, enabling instruments to perform multiple surgical tasks.
Solution Approach 2:
The patent merges previously separate surgical functions into integrated instruments. By combining ultrasonic vibration sources with surgical blades and sensors, the patent creates unified devices that can cut, sense tissue properties, and respond in real-time, eliminating the need for multiple separate instruments.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method allows for the production of high-performance, low-cost medical instruments with enhanced precision, flexibility, and integration of multiple functions, improving surgical accuracy and reducing healing complications by minimizing tissue tearing.
Implementation Method 1
a first material is deposited onto a substrate to give the substrate a controlled profile
Implementation Method 2
The first material is then patterned, e.g., by lithography
Implementation Method 3
The patterned first material is then etched to a desired profile
Implementation Method 4
The second material is then polished, e.g., by a chemical mechanical polishing process
Data Source
Figure 1(a)~1(c)
Figure 1(d)~1(e)
Figure 1(f)~1(g)
AI summary
The present invention provides novel medical instruments and methods for fabricating them by using nano-technology processes.