Medical Semiconductor Shielded Antenna Structure
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Solution Overview
Problem
The semiconductor industry faces challenges in creating medical devices with lower costs and smaller form factors for implantation, as external antennas require feed-throughs in metal casings, increasing costs and making devices bulky and difficult to implant.
Innovation Solution
A medical semiconductor device is designed with a signal re-distribution layer that includes an internal antenna and a metal shield layer, which terminates electromagnetic interference and reduces noise, allowing for wireless communication without the need for external antennas, thereby reducing size and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an external antenna is used for wireless communication, then wireless communication capability is achieved, but the device size increases and becomes bulky
Solution Approach 1:
The patent integrates the antenna structure within the existing metal casing of the medical device, nesting the communication function inside the housing rather than adding it externally. This allows wireless communication capability to be achieved without increasing the overall device volume, as the antenna is accommodated within the existing structural space.
Solution Approach 2:
The patent combines the antenna function with the metal casing structure itself, where the casing serves dual purposes as both protective housing and antenna support/structure. This merging of functions eliminates the need for separate external antenna components, thereby maintaining compact device size while achieving wireless communication.
2Reliability
If feed-throughs are added to the metal casing for the external antenna, then wireless communication is enabled, but the manufacturing cost increases
Solution Approach 1:
The patent merges the antenna function with the existing metal casing, eliminating the need for separate feed-through components and associated sealing operations. By using the casing itself as part of the antenna structure, the manufacturing process is simplified and costs are reduced while maintaining wireless communication capability.
Solution Approach 2:
The patent removes the need for feed-through components and their associated complex sealing requirements by integrating the antenna function directly into the casing structure. This extraction of the feed-through requirement simplifies the manufacturing process and reduces costs.
3Reliability
If feed-throughs and sealing are added to the metal casing, then the antenna can be connected, but the device complexity increases
Solution Approach 1:
The patent combines the antenna support function with the existing metal casing structure, eliminating the need for separate feed-through components and complex sealing arrangements. This integration reduces device complexity while maintaining the necessary antenna connection capability.
4Reliability
If an external antenna is used, then wireless communication is achieved, but the device becomes difficult to implant
Solution Approach 1:
The patent nests the antenna function within the existing device housing, creating a compact integrated unit that is easier to implant. By eliminating the external antenna and its associated mounting requirements, the device becomes more suitable for implantation procedures.
Solution Approach 2:
The patent merges the antenna function with the internal device structure, creating a streamlined compact design that simplifies implantation. The integrated design eliminates external components that would complicate the implantation process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The internal antenna and metal shield layer effectively prevent noise interference, resulting in a smaller, more cost-effective medical device that maintains reliable wireless communication and reduces the complexity of implantation.
Implementation Method 1
a metal shield layer, which terminates electromagnetic interference and reduces noise
Data Source
AI summary
In one embodiment, a semiconductor device is formed to include a plurality of conductor layers that interconnect electrical signals between semiconductor elements of the semiconductor device. A metal shield layer is formed overlying a portion of the plurality of conductor layers. A signal re-distribution layer is formed overlying the metal shield layer.