Fall-Proof Megasonic Cleaning Apparatus with Distance Sensor
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Solution Overview
Problem
The megasonic/ultrasonic devices used in semiconductor cleaning processes can become loose and fall during usage, risking damage to expensive semiconductor devices and requiring frequent cleaning due to contaminant buildup, leading to increased costs and operational challenges.
Innovation Solution
A fall-proof apparatus with a sensor system that detects the distance between the megasonic/ultrasonic device and its carrier, triggering an alarm if loose, and includes a chuck for rotating semiconductor devices and trays for cleaning the device and swing-spray head, ensuring secure operation and regular maintenance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the megasonic/ultrasonic device is fixed firmly on the carrier, then the reliability of the cleaning process is improved, but the device complexity increases due to the need for additional fixation mechanisms and monitoring systems
Solution Approach 1:
The sensor detects the fixation state of the megasonic/ultrasonic device on the carrier before the cleaning process begins. If the device is not properly fixed, the system prevents operation, thereby avoiding potential damage to semiconductor devices and ensuring reliable cleaning processes through advance verification
Solution Approach 2:
The sensor continuously monitors the fixation state of the megasonic/ultrasonic device and provides real-time feedback to the control system. This feedback mechanism enables the system to detect loosening during operation and trigger appropriate responses, maintaining reliability without requiring complex mechanical fixation structures
2Productivity
If the megasonic/ultrasonic device moves during the cleaning process, then the cleaning coverage is improved, but the risk of the device falling off and damaging semiconductor devices increases
Solution Approach 1:
Before the cleaning process starts, the sensor verifies that the megasonic/ultrasonic device is properly fixed to the carrier. This preliminary check ensures that even though the device will move during cleaning to improve coverage, it starts from a secure state, reducing the risk of damage
Solution Approach 2:
During the cleaning process, the sensor continuously monitors the fixation state of the moving megasonic/ultrasonic device. If loosening is detected while the device is in motion, the system can stop operation or adjust movement, maintaining cleaning productivity while preventing damage from unexpected falls
3Manufacturing precision
If the megasonic/ultrasonic device is cleaned frequently, then the cleaning quality is maintained, but the loss of time for maintenance increases
Solution Approach 1:
The sensor detects potential loosening or contamination issues before they affect cleaning quality. By identifying problems in advance, the system can schedule maintenance at optimal intervals rather than requiring frequent preventive cleaning, maintaining manufacturing precision while reducing unnecessary downtime
Solution Approach 2:
The monitoring system automatically tracks the operational status and fixation state of the megasonic/ultrasonic device, enabling predictive maintenance scheduling. This self-monitoring capability allows maintenance to be performed only when actually needed based on real conditions rather than fixed intervals, preserving cleaning quality while minimizing time loss
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents accidental falls of the megasonic/ultrasonic device, reducing the risk of damage to semiconductor devices and facilitating effective cleaning and maintenance, thereby minimizing costs and ensuring reliable semiconductor processing.
Implementation Method 1
a sensor detecting the distance between the megasonic/ultrasonic device and the carrier to determine whether the megasonic/ultrasonic device is loose and going to fall
Implementation Method 2
the megasonic/ultrasonic device is located above the semiconductor device, sending megasonic/ultrasonic waves towards the semiconductor device
Implementation Method 3
under the high frequency vibration effect and the chemical reaction, the molecules of cleaning liquid driven by the megasonic/ultrasonic waves successionally collide with the surface of the semiconductor device
Implementation Method 4
the molecules of cleaning liquid driven by the megasonic/ultrasonic waves successionally collide with the surface of the semiconductor device at a very high speed, by which the particles and tiny contaminants can be removed
Data Source
AI summary
A fall-proof apparatus for cleaning semiconductor devices is provided. The fall-proof apparatus comprises: a nozzle (102) connecting with a carrier (101); a megasonic/ultrasonic device (105) fixing on the carrier (101); and a sensor (104) detecting the distance between the megasonic/ultrasonic device (105) and the carrier (101) to determine whether the megasonic/ultrasonic device (105) is loose and going to fall. The megasonic/ultrasonic device works with the nozzle during a cleaning process. A chamber with the fall-proof apparatus is also provided.