Melting Tool Controller for Warped Substrate Soldering

The patent transitions from perpendicular (one-dimensional) tip movement to inclined (multi-dimensional) movement relative to the substrate surface. By moving the tip along an inclined path rather than directly perpendicular to the substrate, the system achieves warpage correction while avoiding collision with component surfaces, thus reducing tip damage risk while maintaining soldering position accuracy.

The patent applies partial contact detection rather than full pressure contact. By using temperature change detection during inclined movement, the system achieves sufficient contact detection accuracy without applying excessive force that would bend or damage the tip. The temperature sensor detects contact through minimal interaction, avoiding the harmful effects of strong pressing.

The system performs self-positioning through temperature-based contact detection during inclined movement. Instead of requiring the operator to manually calculate and set both P3 and P4 coordinates, the system automatically determines the correct position by detecting temperature changes when the tip contacts the substrate during its inclined approach. This self-service mechanism reduces setting complexity while maintaining the ability to access difficult soldering positions.

The system uses real-time temperature feedback during tip movement to automatically determine contact position. As the tip moves inclined toward the substrate, the temperature sensor continuously monitors for temperature changes indicating contact. This feedback mechanism eliminates the need for time-consuming manual setting of inclined angles and positions, as the system self-adjusts based on thermal feedback, thereby reducing setting time while maintaining access to difficult positions.