Member Bonding Apparatus Alignment and Adhesive Control

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Solution Overview

Problem

Conventional member bonding apparatuses face challenges in achieving accurate positioning of members, maintaining constant adhesive thickness, and preventing adhesive squeeze-out, leading to suboptimal bonded member quality, especially in applications like touch panels where adhesive thickness affects detection sensitivity.

Innovation Solution

The apparatus includes a member alignment preprocessing device for precise alignment using CCD cameras, a thickness measuring and adjusting device to maintain consistent adhesive thickness, and an adhesive curing preprocessing device to prevent edge squeeze-out by curing the adhesive at the bonded member's edge.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If conventional positioning methods are used, then the bonding process is simple, but the positioning accuracy of members is insufficient

Engineering Contradiction:
Improvepositioning accuracyVSAvoidalignment device complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent applies preliminary action by performing preliminary alignment of members before the actual bonding process. The alignment device pre-positions the members using visual feedback from cameras, ensuring accurate positioning is achieved before adhesive application and bonding occur. This separates the alignment function from the bonding function, improving positioning accuracy without significantly complicating the overall bonding process.

Inventive Principle:
Principle #10Preliminary action

2Manufacturing precision

If pressing force is applied to spread adhesive, then bonding is achieved, but adhesive thickness becomes variable when members have different thicknesses

Engineering Contradiction:
Improveadhesive thickness consistencyVSAvoidthickness control device complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent replaces the conventional mechanical pressing method with a controlled positioning system. Instead of applying pressing force to spread adhesive (mechanical approach), the system uses precisely positioned members with controlled spacing to maintain consistent adhesive thickness. The alignment device controls the relative positioning of members, substituting mechanical pressure with positional control, thereby maintaining constant adhesive thickness even when members have different thicknesses.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Reliability

If adhesive is allowed to spread to edges for proper curing, then bonding quality improves, but the bonding process takes longer

Engineering Contradiction:
Improvebonding qualityVSAvoidbonding process time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The patent applies preliminary action by pre-positioning members with precise alignment before bonding. This ensures that adhesive is applied only where needed and spreads optimally without requiring excessive time for edge-to-edge distribution. The pre-alignment enables the adhesive to reach proper curing conditions faster while maintaining bonding quality, as the members are already in their final positions.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent implements periodic action through the curing process where adhesive is allowed to spread and cure in controlled intervals. The system enables the adhesive to spread to edges for proper curing while managing the time requirement through efficient positioning that minimizes the distance adhesive needs to travel, thus balancing bonding quality with process time.

Inventive Principle:
Principle #19Periodic action

4Productivity

If members are bonded with variable adhesive thickness, then the bonding process is faster, but detection sensitivity in touch panels becomes irregular

Engineering Contradiction:
Improvebonding speedVSAvoiddetection sensitivity uniformity
Core Design Contradiction:
ProductivityVSMeasurement precision

Solution Approach 1:

The patent replaces mechanical pressing that causes variable adhesive thickness with a precision positioning system. The alignment device maintains constant spacing between members, ensuring uniform adhesive thickness distribution. This substitution preserves bonding speed while achieving uniform detection sensitivity across the entire touch panel surface, as the adhesive layer remains consistent in thickness throughout the bonded area.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables rapid and accurate member alignment, maintains consistent adhesive thickness, and prevents adhesive squeeze-out, resulting in improved bonded member quality and detection sensitivity in applications like touch panels.

Implementation Method 1

There has been another apparatus configured to irradiate the adhesive with ultraviolet light to increase the viscosity and spread enough liquid resin between the members

Methodology Applied
Scientific EffectUltraviolet light irradiation: Photopolymerisation

Data Source

PatentUS9726916B2Member bonding apparatus
Publication Date: 2017.08.08 ORIGIN CO LTD(JP)
  • US9726916B2 patent drawing
  • US9726916B2 patent drawing
  • US9726916B2 patent drawing

AI summary

To provide a member bonding apparatus that can accurately position two members for bonding. Member alignment preprocessing device 15 adjusts to align one of the two members received by member receiving device 11 with another member in X and Y-axis directions so that the positions of bonding surfaces of the two members approximately correspond, adhesive application device 12 applies adhesive to a bonding surface of one of the two members approximately aligned, member alignment device 16 adjusts to align another member with one of the two members in X, Y, Z-axis and α, β, θ-axis directions based on images of the two members captured by a CCD camera so that positions of the bonding surfaces of the two members correspond, member bonding device 13 makes the bonding surfaces of the two members aligned be bonded to each other through the adhesive, and member delivery device 14 unloads and delivers the bonded member.