Inflatable Membrane Bonding Tool With PEEK Layer for Die Alignment
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Solution Overview
Problem
The increasing complexity and miniaturization of semiconductor integrated circuits (ICs) have made processing and manufacturing more challenging, necessitating improved methods for bonding dies onto substrates to enhance yield and bonding strength.
Innovation Solution
A bonding tool using a polymer layer between a membrane and a die, combined with a controlled inflation and deflation process, to apply uniform force and reduce die shift, thereby increasing yield and bonding strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional bonding methods are used, then manufacturing process is simpler, but die yield is lower and bonding strength is insufficient
Solution Approach 1:
A polymer layer is introduced as an intermediary between the bonding tool membrane and the die. This polymer layer acts as a mediator that distributes bonding force uniformly across the die surface, preventing localized stress concentrations that cause defects. The polymer layer enables reliable die bonding while maintaining process simplicity by serving as a straightforward intermediate component rather than a complex multi-step process.
Solution Approach 2:
The bonding process utilizes temperature and pressure as controllable parameters to achieve reliable bonding. By heating the die and substrate to elevated temperatures and applying controlled pressure through the inflated membrane, the bonding interface achieves optimal adhesion. These parameter changes enable high die yield and bonding strength without requiring complex process steps.
2Strength
If conventional bonding methods are used, then process is simpler, but bonding strength is lower
Solution Approach 1:
The polymer layer serves as a bonding intermediary that enhances interfacial adhesion between the die and substrate. It distributes the bonding force uniformly across the entire die surface, preventing stress concentrations that would reduce bonding strength. This simple intermediary component achieves superior bonding strength without requiring a complex bonding tool structure.
Solution Approach 2:
The bonding tool employs an inflatable membrane that uses pneumatic pressure to apply uniform force across the die during bonding. The membrane can be inflated to the desired pressure level and then deflated after bonding, providing a simple yet effective mechanism for achieving high bonding strength without complex mechanical pressing systems.
3Strength
If higher bonding force is applied, then bonding strength increases, but die shift and warpage increase
Solution Approach 1:
The polymer layer acts as a compliant intermediary that distributes bonding force uniformly across the die surface. This uniform force distribution prevents localized stress concentrations that would cause die shift or warpage. The polymer's compliance allows high bonding forces to be applied without creating the uneven stress fields that lead to positioning errors or deformation.
Solution Approach 2:
The polymer layer functions as a flexible thin film that conforms to the die surface and distributes applied pressure uniformly. This flexibility ensures that high bonding forces are transmitted evenly across the entire die- substrate interface, preventing the die from shifting or warping during the bonding process while still achieving high bonding strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves die yield increases of 10%-20% and die bonding strength enhancement of 0.5 J/m2, while reducing die shift and warpage-related delamination.
Implementation Method 1
inflating a membrane of the bonding tool disposed above the substrate and the edge ring to expand the membrane downwards
Implementation Method 2
applying a force from the inflating membrane on the plurality of dies via the polymer layer
Data Source
AI summary
Embodiments of the present disclosure provide a bonding tool for bonding dies onto substrates and a method that includes positioning a substrate and a plurality of dies over a substrate support of a bonding tool, wherein the plurality of dies are disposed on the substrate, and the substrate is surrounded by an edge ring, inflating a membrane of the bonding tool disposed above the substrate and the edge ring to expand the membrane downwards, wherein a polyetheretherketone (PEEK) layer attached to the membrane rests on the edge ring, and applying a force from the inflating membrane on the plurality of dies via the PEEK layer.