Membrane Cavity Packaging for Compact Hermetic Electrical Devices
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Solution Overview
Problem
Existing electrical devices with membranes, such as BAW filters and MEMS, face challenges in miniaturization due to the need for clearance and increased size, as well as manufacturing costs and issues like work-outgassing and flux contamination from metal lids, which hinder efficient isolation and protection of the membrane.
Innovation Solution
An electrical device design featuring a membrane within a cavity of an electronic component, covered by a separate cover, eliminating the need for a metal lid, thereby reducing size and manufacturing complexity, and using an adhesive or metallic bonding to attach wafers, ensuring hermetic sealing and reducing contamination risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal lid is used to cover and isolate the membrane, then the membrane is protected from environmental contact, but the device size increases and manufacturing complexity increases due to work-outgassing and flux contamination issues
Solution Approach 1:
The patent removes the metal lid from the device structure entirely, replacing it with a direct bonding approach between the substrate and cover. This extraction eliminates the manufacturing complexities associated with metal lid attachment (work-outgassing and flux contamination) while maintaining the protective function through alternative means.
Solution Approach 2:
The substrate is designed to serve multiple functions: it acts as both the structural base and the bonding interface for hermetic sealing. By integrating the sealing function directly into the substrate-covers bonding process rather than using a separate metal lid, the device achieves both structural support and environmental protection without additional manufacturing steps.
2Reliability
If a metal lid is used to protect the membrane, then the membrane is isolated from environmental factors, but the device size increases
Solution Approach 1:
The metal lid component is completely removed from the device architecture. The protective function previously performed by the metal lid is achieved through direct bonding between the substrate and cover, which creates a compact hermetic seal without the additional space requirements of a separate lid structure.
3Reliability
If a metal lid is used for membrane isolation, then the membrane is protected from environmental contact, but manufacturing costs increase due to work-outgassing and flux contamination issues
Solution Approach 1:
The patent eliminates the metal lid and its associated attachment processes. By using direct bonding between the substrate and cover, the manufacturing process avoids the costly and complex steps of metal lid attachment, including work-outgassing management and flux contamination control, thereby reducing manufacturing costs.
4Reliability
If clearance is specified for the membrane to avoid affecting device performance, then the membrane is isolated from other objects, but the device size increases
Solution Approach 1:
The membrane is nested within the cavity formed by the substrate and cover bonding interface. This nesting approach allows the membrane to be positioned within the device footprint rather than requiring additional clearance space around it, maintaining performance isolation while minimizing overall device area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design minimizes the size and manufacturing costs of electrical devices, protects the membrane from environmental contact, and addresses issues like work-outgassing and flux contamination, while maintaining the functionality of the membrane for signal detection and isolation.
Implementation Method 1
using an adhesive or metallic bonding to attach wafers
Implementation Method 2
using an adhesive or metallic bonding to attach wafers
Data Source
AI summary
An electrical device includes an electronic component, a membrane and a cover. The electronic component has a first surface and a second surface opposite to the first surface. The electronic component has a cavity extending from the first surface of the electronic component into the electronic component. The membrane is disposed within the cavity of the electronic component. The cover is disposed on the first surface of the electronic component.