Membrane Test Structure for Micro Bump Alignment and Contact
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Solution Overview
Problem
Existing semiconductor test methods face challenges in accurately testing electrical connections of micro bumps in stacked semiconductor devices without causing damage or misalignment, particularly due to the small size and susceptibility of these bumps to deformation.
Innovation Solution
A semiconductor test device with a membrane portion and holder portion, featuring aperture patterns and conductive thin film layers, allows for precise alignment and contact with micro bumps using elastic and low-thermal-expansion materials, and includes a manufacturing method to form these components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional test methods are used to test micro bumps, then testing can be performed, but damage to micro bumps and misalignment occur due to their small size and susceptibility to deformation
Solution Approach 1:
The patent employs a flexible membrane structure with aperture patterns that can elastically deform to contact micro bumps. The membrane includes a first membrane portion with first aperture patterns and a second membrane portion with second aperture patterns, allowing gentle, compliant contact that prevents damage to the fragile micro bumps while maintaining reliable electrical connection for testing
Solution Approach 2:
The patent introduces a flexible membrane as an intermediary between the test equipment and the micro bumps. This membrane with aperture patterns serves as a mediator that distributes contact forces and enables precise alignment, preventing direct damaging contact while facilitating reliable electrical connection for testing
2Reliability
If conventional test contact methods are used, then testing can be performed, but misalignment occurs during connection
Solution Approach 1:
The patent utilizes visual indicators (aperture patterns visible through the membrane) to enable precise alignment during the connection process. The aperture patterns serve as visual guides that allow operators to accurately position and align the test device with the micro bumps, ensuring precise connection without misalignment
Solution Approach 2:
The flexible membrane with aperture patterns provides both visual alignment guidance and elastic deformation capability, enabling precise positioning during connection while accommodating minor misalignments through elastic deformation, thereby ensuring reliable electrical connection
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables reliable testing of electrical connections while minimizing damage to micro bumps and ensuring accurate alignment, reducing defects and improving yield in semiconductor manufacturing.
Implementation Method 1
elastic and low-thermal-expansion materials
Implementation Method 2
elastic and low-thermal-expansion materials
Implementation Method 3
a first conductive thin film layer is formed on a side surface of each of the first aperture patterns, and a second conductive thin film layer is formed on a side surface of each of the second aperture patterns
Data Source
AI summary
The present invention relates to a semiconductor test device and a manufacturing method thereof. The semiconductor test device according to one embodiment of the present invention is characterized by being interposed between semiconductor memories, or between a semiconductor memory and an interposer, to test an electrical connection.