Membrane Probe Structure for Micro Bump Alignment and Damage Prevention
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Solution Overview
Problem
Existing semiconductor test methods face challenges in accurately testing micro bumps of stacked semiconductor chips without causing damage or misalignment, particularly due to their small size and susceptibility to deformation during testing.
Innovation Solution
A semiconductor test device with a membrane portion featuring aperture patterns and an electrical path portion, made of insulating and conductive materials, is used to contact and test micro bumps, minimizing damage and ensuring precise alignment through elastic and conductive pathways.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional test methods are used to contact micro bumps, then testing can be performed, but damage to micro bumps and misalignment occur due to their small size and susceptibility to deformation
Solution Approach 1:
The patent employs a flexible membrane structure with aperture patterns that can elastically deform to contact micro bumps. The membrane includes an insulating layer with aperture patterns formed therein, allowing the structure to flex and conform to the micro bump surface without causing damage. This flexible contact mechanism resolves the contradiction by enabling reliable electrical contact while preventing mechanical damage to the fragile micro bumps.
Solution Approach 2:
The patent introduces an intermediary elastic body between the test device and the micro bumps. This elastic body with aperture patterns serves as a mediator that distributes contact pressure and prevents direct rigid contact that would cause damage. The intermediary structure enables testing functionality while protecting the micro bumps from harmful mechanical stress.
2Manufacturing precision
If rigid contact structures are used for testing, then alignment can be maintained, but damage occurs to the small micro bumps
Solution Approach 1:
The flexible membrane with aperture patterns provides both alignment precision and damage prevention. The membrane's elasticity allows it to maintain precise alignment through controlled deformation while distributing contact forces to prevent micro bump damage. This resolves the contradiction between maintaining alignment precision and preserving micro bump integrity.
Solution Approach 2:
The patent changes the mechanical parameters of the contact structure from rigid to elastic/flexible. By using materials and structures with appropriate elastic moduli and flexibility, the system can maintain alignment through elastic deformation while reducing contact stress to prevent damage. This parameter change resolves the contradiction between alignment precision and micro bump strength.
3Reliability
If insulating material is used for the membrane portion, then electrical isolation is achieved, but conductive pathways must be separately formed
Solution Approach 1:
The patent uses an insulating membrane with aperture patterns (porous structure) where the apertures serve as conduits for conductive pathways. The porous/apertured insulating material provides both electrical isolation between adjacent contacts and defined pathways for electrical connection through the membrane. This resolves the contradiction by integrating both insulation and conduction functions into a single structured component.
Solution Approach 2:
The membrane structure combines insulating material with conductive elements (such as conductive paste, metal traces, or conductive particles) to create a composite structure. The insulating matrix provides electrical isolation while the embedded conductive elements provide the necessary electrical pathways. This composite approach resolves the contradiction between achieving electrical isolation and forming conductive pathways.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for effective testing of micro bumps while preventing damage and ensuring accurate alignment, reducing defects and improving the reliability of semiconductor devices.
Implementation Method 1
an electrical connection path is formed from the top to the bottom of each aperture pattern
Implementation Method 2
the electrical path portion may include an elastic matrix made of an elastic material, and at least one of a plurality of conductive particles, a plurality of conductive rods, a plurality of conductive wires, a plurality of conductive balls, or a plurality of conductive flakes may be dispersed in the elastic matrix
Data Source
AI summary
The present invention relates to a semiconductor test device and a manufacturing method thereof. The semiconductor test device according to an embodiment of the present invention is a semiconductor test device which is interposed between semiconductor memories, or between a semiconductor memory and an interposer, to perform a test of an electrical connection, and may include: a membrane portion comprising a plurality of aperture patterns in a thickness direction; and a holder portion having a hollow region and connected to an edge of the membrane portion, wherein neighboring aperture patterns are insulated from each other and an electrical connection path is formed from a top to a bottom of each aperture pattern.