Membrane Probe Pressing Mechanism for Semiconductor Inspection
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Solution Overview
Problem
The challenge in semiconductor integrated circuit device inspection is the difficulty in aligning probes with narrow-pitch test pads, which can lead to foreign matter attachment and breakage of the membrane probe, reducing yields and causing misalignment issues during probe inspection.
Innovation Solution
A method involving a probe card with a pressing mechanism that includes a first and second pressing portion, where the second pressing portion has a smaller plane size, minimizing contact area and reducing the likelihood of foreign matter attachment, and a hole in the pressing member for accurate alignment of the pressing pin.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a pressing mechanism with large contact area is used to press the membrane probe, then the probe can be pressed firmly against the pad, but the likelihood of foreign matter attachment and probe breakage increases
Solution Approach 1:
The pressing mechanism employs a two-stage pressing structure where the first pressing portion applies initial pressure and the second pressing portion with smaller area provides concentrated final pressure. This local differentiation of pressing area allows firm contact without excessive overall pressure that would increase foreign matter attachment risk.
Solution Approach 2:
The pressing mechanism is divided into two distinct pressing portions: a first pressing portion with larger area and a second pressing portion with smaller area. This segmentation allows the pressing action to be distributed differently across the membrane probe, reducing stress concentration and foreign matter attachment while maintaining effective probe-pad contact.
2Stability of the object's composition
If the pressing mechanism presses a large area of the membrane probe, then the probe is stabilized, but the alignment precision with narrow-pitch test pads deteriorates
Solution Approach 1:
The first pressing portion stabilizes the membrane probe over a larger area while the second pressing portion concentrates pressure on a smaller area directly over the test pad. This local quality differentiation maintains probe stability during positioning while enabling precise alignment with narrow-pitch test pads during the final pressing stage.
3Ease of manufacture
If the pressing pin alignment is not accurate, then the pressing mechanism is easier to manufacture, but the probe inspection yield decreases due to misalignment
Solution Approach 1:
The membrane probe acts as a flexible element that can compensate for minor misalignments between the pressing pin and the test pad. The flexibility of the thin film membrane allows it to deform and maintain contact even when alignment is not perfect, reducing the need for extremely precise pressing pin positioning while maintaining inspection yield.
Data Source
AI summary
A technique of manufacturing a semiconductor integrated circuit device is provided for reducing the possibility of attachment of foreign matter to a membrane probe when performing probe inspection using the membrane probe formed by the manufacturing technique. A pressing member for pressing a membrane sheet includes a pressing pin receiving portion relatively disposed above for receiving the tip of a pressing pin of the plunger in a recess, and a membrane sheet pressing portion relatively disposed below. The membrane sheet pressing portion in contact with the membrane sheet has the minimum plane size to enable pressing of the entire surface of one chip of interest to be subjected to the probe inspection.