Membrane Wafer Frame for Vertical Solar Cell Processing
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Solution Overview
Problem
The existing system for preparing silicon heterojunction solar cells is large in occupied area and high in cost due to the need for multiple reactive chambers and automation equipment, as well as the requirement for wafer flipping and substrate transfer to prevent cross-contamination.
Innovation Solution
A manufacturing system that uses a movable frame with a membrane to process wafers vertically, reducing the occupied area and cost by eliminating the need for multiple chambers and automation equipment, and allowing for simultaneous processing of both sides of the wafer without flipping, using a membrane with membrane openings that expose the wafer surfaces for processing stations like etching, PECVD, and PVD deposition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple reactive chambers and automation equipment are used to process wafers, then manufacturing precision and reliability are improved, but occupied area and cost increase
Solution Approach 1:
The patent combines multiple processing functions (etching, PECVD, PVD deposition) into a single integrated reaction chamber. The wafer is processed on both front and back sides within the same chamber without flipping, eliminating the need for multiple separate chambers and associated automation equipment, thereby reducing occupied area while maintaining manufacturing reliability
Solution Approach 2:
The single reaction chamber is designed to perform multiple processing functions sequentially - etching, PECVD deposition, and PVD deposition - all within the same chamber. This multi-functional approach replaces what would traditionally require multiple specialized chambers, reducing the overall system footprint while maintaining comprehensive wafer processing capability
2Manufacturing precision
If wafer flipping and substrate transfer are performed to prevent cross contamination, then manufacturing precision is improved, but device complexity and cost increase
Solution Approach 1:
The wafer is divided into front and back sides that are processed separately in sequence within the same chamber. By processing one side at a time without flipping, the system avoids the complexity of wafer handling mechanisms while maintaining processing quality through sequential single-sided processing
Solution Approach 2:
The patent introduces a susceptor as an intermediary element that holds the wafer in a fixed orientation. The susceptor allows the wafer to be processed on alternating sides without requiring the wafer itself to be flipped or transferred, simplifying the system by eliminating complex automation equipment while maintaining processing precision
3Productivity
If automation equipment is used for distributing and collecting wafers, then productivity is improved, but occupied area and cost increase
Solution Approach 1:
The patent combines wafer distribution, processing, and collection functions into a single integrated system. The susceptor holds multiple wafers in a stack, allowing sequential processing without requiring external automation equipment for transfer and distribution, thereby maintaining productivity while reducing occupied area
Solution Approach 2:
The susceptor serves multiple functions - it holds the wafers, positions them for processing, and facilitates their sequential treatment within the chamber. This self-contained approach eliminates the need for separate automation equipment, reducing system complexity and occupied area while maintaining efficient wafer throughput
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively reduces the occupied area and costs associated with solar cell manufacturing while maintaining product stability and efficiency, enabling the formation of high-quality solar cells with reduced complexity and equipment needs.
Implementation Method 1
the membrane is configured to maintain the wafer at a certain position with respect to the frame
Implementation Method 2
the transport mechanism is configured to transport the frame while the membrane is coupled to the frame, and while the wafer is coupled to the membrane
Implementation Method 3
the frame comprises a first magnet, and wherein the transport mechanism comprises a second magnet configured to interact with the first magnet of the frame to maintain the frame at a certain position with respect to the transport mechanism
Implementation Method 4
an etching station configured to provide dry etching for the wafer
Implementation Method 5
a PECVD station configured to provide PECVD deposition for the wafer
Implementation Method 6
a PVD station configured to provide PVD deposition for the wafer
Data Source
AI summary
A system for wafer processing, includes: a frame comprising a frame opening; and a membrane configured to couple to the frame and to cover at least a part of the frame opening, the membrane comprising a membrane opening, wherein the membrane opening has a membrane opening area that is equal to or less than a frame opening area of the frame opening; wherein the membrane is configured for coupling with the wafer, wherein when the wafer is coupled with the membrane, the wafer covers the membrane opening, and wherein the membrane is configured to maintain the wafer at a certain position with respect to the frame; and wherein the membrane opening area is less than a total area of the wafer.