Membrane Wafer Holder for Vertical Solar Cell Processing

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Solution Overview

Problem

The existing system for preparing silicon heterojunction solar cells is large in occupied area and high in cost due to the need for multiple reactive chambers and automation equipment, as well as the requirement for wafer flipping and substrate transfer to prevent cross-contamination.

Innovation Solution

A manufacturing system that uses a frame with a membrane to process wafers vertically, reducing the occupied area and cost by allowing for sequential processing at multiple stations without the need for wafer flipping, and utilizing a membrane with membrane openings that are smaller than the wafer to maintain the wafer's position and facilitate processing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If multiple reactive chambers and automation equipment are used, then manufacturing precision and reliability are improved, but occupied area and cost increase

Engineering Contradiction:
Improvemanufacturing precisionVSAvoidoccupied area
Core Design Contradiction:
Manufacturing precisionVSArea of stationary object

Solution Approach 1:

The patent merges multiple reactive chambers into a single integrated chamber that can sequentially process both front and back sides of wafers. The chamber is equipped with a movable shelf that can be positioned to expose either the front or back surface of wafers mounted on a membrane, eliminating the need for separate chambers for front-side and back-side processing while maintaining manufacturing precision.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent introduces a dynamic movable shelf within the reaction chamber that can be repositioned during the processing cycle. This dynamic element allows the same chamber to adapt its configuration for processing different surfaces of the wafer sequentially, replacing the need for static multiple chambers and reducing the overall occupied area.

Inventive Principle:
Principle #15Dynamics

2Reliability

If wafer flipping and substrate transfer are performed, then cross-contamination is prevented, but device complexity and cost increase

Engineering Contradiction:
ImprovereliabilityVSAvoiddevice complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent extracts the wafer from the traditional substrate holder and mounts it directly onto a membrane that spans the reaction chamber. This membrane-based mounting system simplifies the overall device structure by eliminating complex substrate transfer mechanisms and wafer flipping equipment, while the membrane can be easily removed and replaced to prevent cross-contamination between batches.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The membrane used to mount wafers can be discarded after a single use or recovered and replaced for subsequent processing cycles. This approach prevents cross-contamination between different wafer batches without requiring complex cleaning or sterilization systems, thereby reducing device complexity while maintaining reliability.

Inventive Principle:
Principle #34Discarding and recovering

3Productivity

If automation equipment is used, then productivity is improved, but occupied area and cost increase

Engineering Contradiction:
ImproveproductivityVSAvoidoccupied area
Core Design Contradiction:
ProductivityVSArea of stationary object

Solution Approach 1:

The patent combines multiple processing functions (front-side processing, back-side processing, and wafer mounting) into a single integrated chamber with a movable shelf system. This consolidation maintains productivity by enabling sequential processing of both wafer surfaces in one chamber while significantly reducing the occupied area compared to multiple separate chambers with automation equipment.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS11888082B2Systems and methods for making solar panels or components thereof
Publication Date: 2024.01.30 DUAL HELIOS SEMICON EQUIP CO INC
  • US11888082B2 patent drawing
  • US11888082B2 patent drawing
  • US11888082B2 patent drawing

AI summary

A system for wafer processing, includes: a frame comprising a frame opening; and a membrane configured to couple to the frame and to cover at least a part of the frame opening, the membrane comprising a membrane opening, wherein the membrane opening has a membrane opening area that is equal to or less than a frame opening area of the frame opening; wherein the membrane is configured for coupling with the wafer, wherein when the wafer is coupled with the membrane, the wafer covers the membrane opening, and wherein the membrane is configured to maintain the wafer at a certain position with respect to the frame; and wherein the membrane opening area is less than a total area of the wafer.