Memory Address Conversion for Cell Die Temperature Balancing
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Solution Overview
Problem
Semiconductor memory devices with stacked cell dies experience temperature rises due to concentrated access, leading to deteriorating data storage characteristics and data corruption in both the accessed and adjacent cell dies.
Innovation Solution
A semiconductor memory device with a control circuit that includes an address decoder and an address conversion circuit, which decodes and converts address signals to distribute access requests more randomly across cell dies, reducing concentrated access and associated temperature increases without requiring additional thermal sensing elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If address signals are decoded directly to access cell dies, then data I/O performance is maintained, but temperature rises due to concentrated access to specific cell dies
Solution Approach 1:
An address conversion circuit is introduced as an intermediary between the address decoder and cell die selection. This circuit converts the original address signal to a different address that maps to a different cell die, thereby distributing access patterns and reducing concentrated heat generation while maintaining full data I/O capability.
Solution Approach 2:
The address conversion circuit changes the address parameter to redirect access from one cell die to another. By modifying the address signal's target destination without affecting the data transfer operation, the system distributes thermal load across multiple cell dies while preserving productivity.
2Reliability
If access requests are concentrated on specific cell dies, then data I/O speed is improved, but data storage characteristics deteriorate and data corruption occurs due to high temperatures
Solution Approach 1:
The address conversion circuit acts as a mediator that redistributes access requests across multiple cell dies. This prevents any single cell die from experiencing concentrated access that would cause overheating and data corruption, thereby improving reliability while maintaining acceptable data I/O speed through parallel access distribution.
Solution Approach 2:
The system segments the access load across multiple cell dies using address conversion. Instead of concentrating all access requests on specific cell dies for high speed, the address conversion circuit distributes requests to different cell dies, improving data storage reliability through thermal management while maintaining overall system throughput.
Data Source
AI summary
A semiconductor memory device includes a cell circuit including a plurality of cell dies arranged in a cell die stack. The semiconductor device also includes a control circuit configured to control the cell circuit, wherein the control circuit includes an address decoder and an address conversion circuit. The address decoder is configured to decode an address signal provided by a host and to output address information including a first address which identifies a first cell die, of the plurality of cell dies, requested by the host. The address conversion circuit is configured to convert the first address to a second address using the address information and to provide the second address to the cell circuit, wherein the second address is used to identify a second cell die of the plurality of cell dies different from the first cell die.