Memory Air Cooling Device with Conduction Plates
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Solution Overview
Problem
Increasing memory thermal design power and densities in servers lead to inadequate airflow and cooling challenges, particularly for dual in-line memory modules (DIMMs), where edge DIMMs receive less airflow and custom cooling solutions are costly and limited in application.
Innovation Solution
A combination heat sink and air director apparatus with conduction plates positioned between memory cards, thermally coupled to a heat sink, and air impedance management to balance airflow between the heat sink and adjacent components, allowing a chosen percentage of airflow to pass through for effective cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If memory capacity and density are increased to higher levels, then memory storage capability is improved, but thermal design power and cooling requirements increase significantly
Solution Approach 1:
The patent combines the heat sink and air director functions into a single integrated apparatus. The heat sink provides thermal management while the air director portion actively manages airflow distribution, creating a unified cooling solution that addresses both heat dissipation and airflow balance requirements of high-capacity memory
2Speed
If air baffles are used to force air into CPU heat sinks and DIMM banks, then airflow direction control is improved, but fan operating pressures increase and overall air flow is reduced
Solution Approach 1:
The air director apparatus acts as an intermediary component that redirects airflow through its extended surfaces and geometric configuration. Instead of using baffles to force air, the air director passively guides airflow along its structure, reducing the energy required for air movement while maintaining effective cooling
3Temperature
If custom memory with pre-installed heat sinks is used, then cooling capability is improved, but server customization is required and cost increases
Solution Approach 1:
The heat sink and air director apparatus is designed as a universal cooling solution that can be applied to multiple DIMM configurations and server architectures. The standardized design works with both custom and commodity memory, eliminating the need for specialized custom memory modules while providing effective thermal management
4Area of stationary object
If DIMM spacing is reduced for denser component layout, then space utilization is improved, but airflow to edge DIMMs is further reduced
Solution Approach 1:
The air director apparatus is specifically designed to address the unique airflow challenges at edge DIMM locations. The extended surfaces and directional geometry of the air director target airflow distribution to areas that receive less natural airflow, creating localized improvement in cooling for edge positions without requiring increased spacing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances airflow balance and cooling efficiency for DIMMs, reducing the need for costly custom cooling solutions and increasing DIMM capacity and inlet temperature support in servers.
Implementation Method 1
conduction plates positioned between memory cards, thermally coupled to a heat sink
Implementation Method 2
heat sink thermally coupled to the conduction plates and mounted above the conduction plates
Implementation Method 3
heat sink thermally coupled to the conduction plates and mounted above the conduction plates
Implementation Method 4
An air impedance of air flow through an interface comprising air flow to the heat sink is selected to balance air flow between the interface and components of the computing device adjacent to the interface
Data Source
AI summary
A combination heat sink and air director apparatus includes a plurality of conduction plates. Each conduction plate is positioned to extend into a gap between adjacent memory cards of a plurality of memory cards previously installed in memory card slots of a motherboard of a computing device. The apparatus includes a heat sink thermally coupled to the conduction plates and mounted above the conduction plates. An air impedance of air flow through an interface includes air flow to the heat sink is selected to balance air flow between the interface and components of the computing device adjacent to the interface. A chosen percentage of air flow passes through the interface for the balance of air flow.