Memory Bank Data Transfer via Internal Data Bus

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Solution Overview

Problem

Existing memory systems face inefficiencies in data transfer between banks, leading to increased processing time and power consumption due to reliance on external data buses, which can be improved by enabling internal data bus transfers within memory devices.

Innovation Solution

Implementing an internal data bus within memory devices to facilitate direct data transfer between banks without using external data buses, utilizing sensing circuitry to perform operations and reduce reliance on external processing resources.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If data transfer between banks uses external data buses, then device complexity is reduced, but processing time increases and power consumption increases

Engineering Contradiction:
Improvedata bus structureVSAvoidprocessing time
Core Design Contradiction:
Device complexityVSLoss of time

Solution Approach 1:

The patent introduces a new spatial dimension for data transfer by implementing an internal data bus within the memory device that enables direct bank-to-bank communication. This internal pathway operates in parallel to the external bus system, creating a multi-dimensional data transfer architecture where data can move internally without traversing external connectors and traces, thereby reducing processing time while maintaining structural simplicity

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Device complexity

If data transfer between banks uses external data buses, then device complexity is reduced, but power consumption increases

Engineering Contradiction:
Improvedata bus structureVSAvoidpower consumption
Core Design Contradiction:
Device complexityVSUse of energy by moving object

Solution Approach 1:

The patent creates an internal data transfer pathway that operates within the memory device footprint, eliminating the need for data to traverse external bus connectors and PCB traces. This internal dimension reduces the physical distance data must travel and the number of interface stages, thereby reducing power consumption while keeping the overall device structure relatively simple

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Ease of manufacture

If processing resources are external to memory array, then ease of manufacture is improved, but processing performance decreases

Engineering Contradiction:
Improvedevice assemblyVSAvoidprocessing performance
Core Design Contradiction:
Ease of manufactureVSProductivity

Solution Approach 1:

The patent merges the processing resources with the memory array by integrating the internal data bus and control logic directly into the memory device fabric. This consolidation allows processing operations to occur in close proximity to data storage, reducing access latency and improving processing performance while maintaining manufacturing simplicity through standard integrated circuit fabrication processes

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS20250355561A1Bank to bank data transfer
Publication Date: 2025.11.20 LODESTAR LICENSING GROUP LLC
  • US20250355561A1 patent drawing
  • US20250355561A1 patent drawing
  • US20250355561A1 patent drawing

AI summary

The present disclosure includes apparatuses and methods to transfer data between banks of memory cells. An example includes a plurality of banks of memory cells and a controller coupled to the plurality of subarrays configured to cause transfer of data between the plurality of banks of memory cells via internal data path operations.