Integrating Memory and Baseband Processing in Wireless Devices
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Solution Overview
Problem
In wireless communication devices, the external memory package requires a large number of pins and PCB conducting paths for signal transmission, leading to increased size, cost, and reduced signal quality and operation speed.
Innovation Solution
Integrating the processing circuit and memory into a single semiconductor package, eliminating the need for package pins and reducing the number of PCB conducting paths, while allowing for improved signal quality and operation speed through bonding wires and a system-in-package (SIP) configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the memory package is installed external to the baseband processing package, then the signal transmission can be achieved, but a large amount of package pins and PCB conducting paths are required, increasing the area occupation and reducing signal quality
Solution Approach 1:
The patent combines the memory package and baseband processing package into a single integrated package, eliminating the need for external memory installation. This merging removes the interface between separate packages, reducing package pin requirements and PCB conducting paths while improving signal quality by eliminating external signal transmission paths.
2Reliability
If the memory package is installed external to the baseband processing package, then the signal transmission can be achieved, but a large amount of package pins and PCB conducting paths are required, increasing the area occupation
Solution Approach 1:
The patent integrates the memory package and baseband processing package into a single package structure, eliminating the need for separate external memory installation. This integration removes the interface requirements between separate packages, significantly reducing the area occupied by package pins and PCB conducting paths on the wireless communication module.
3Productivity
If the external memory package is used, then the data storage function is achieved, but the PCB conducting paths bring lower signal quality and limited operation speed
Solution Approach 1:
The patent integrates the memory package and baseband processing package into a single package, eliminating external PCB conducting paths. This integration enables direct internal signal transmission between the memory and processing unit, removing the signal quality degradation and speed limitations imposed by external PCB paths.
Data Source
AI summary
A wireless communication device including an integrated processing circuit and a first memory is provided. The integrated processing circuit includes a processing unit capable of processing a wireless communication signal and a radio frequency (RF) unit capable of performing a conversion between a radio frequency (RF) signal and a baseband signal, wherein the wireless communication signal is one of the RF signal and the baseband signal. The first memory is coupled to the integrated processing circuit. The first memory is capable of storing data used by the processing unit, wherein the integrated processing circuit and the first memory are packaged in a single semiconductor package.