Memory Device Edge and Middle Buffer Circuit Signal Transmission

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Solution Overview

Problem

Semiconductor memory devices face challenges in increasing capacity while maintaining high-speed signal transmission without increasing the device area, particularly due to the need for additional circuitry for signal transmission which can lead to increased power consumption and delay times.

Innovation Solution

The implementation of a memory device with an edge buffer circuit and a middle buffer circuit connected through signal lines above the memory cell array, transmitting differential small-swing signals to enable high-speed signal transmission without the need for repeaters or inverters, thus minimizing area expansion and power consumption.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a circuit for signal transmission is added to the memory cell array, then signal transmission capability is improved, but the area of the memory device increases

Engineering Contradiction:
Improvesignal transmission capabilityVSAvoidmemory device area
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The signal transmission path is segmented into two separate buffer circuits positioned at opposite sides of the memory cell array. The edge buffer circuit receives external signals through pads at one side, while the middle buffer circuit is placed at the opposite side to receive transmitted signals. This segmentation allows signal transmission without adding circuits within the memory cell array, thus maintaining compact area while improving signal transmission capability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces signal lines as intermediary transmission channels that extend from the edge buffer circuit through the memory cell array to the middle buffer circuit. These signal lines act as mediators that carry differential small-swing signals across the memory device without requiring additional active circuits within the memory cell array, thereby enabling signal transmission while preserving area efficiency.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If conventional signal transmission circuits are used, then signal transmission is achieved, but power consumption increases

Engineering Contradiction:
Improvesignal transmissionVSAvoidpower consumption
Core Design Contradiction:
ReliabilityVSUse of energy by stationary object

Solution Approach 1:

The patent changes the signal transmission parameter by using differential small-swing signals instead of conventional full-swing signals. The edge buffer circuit drives the signal lines with differential signals that have smaller voltage swings, which reduces the dynamic power consumption while maintaining signal integrity across the memory device. This parameter change enables efficient signal transmission with lower power consumption.

Inventive Principle:
Principle #35Parameter changes

3Reliability

If conventional signal transmission circuits are used, then signal transmission is achieved, but delay time increases

Engineering Contradiction:
Improvesignal transmissionVSAvoiddelay time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

By segmenting the signal transmission function into separate edge and middle buffer circuits positioned at opposite sides of the memory cell array, the patent eliminates the need for signal to traverse through multiple intermediate circuits within the memory cell array. This segmentation reduces the total propagation delay and enables faster signal transmission across the memory device.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS10580462B2Memory device, memory system and electronic device
Publication Date: 2020.03.03 SAMSUNG ELECTRONICS CO LTD
  • US10580462B2 patent drawing
  • US10580462B2 patent drawing
  • US10580462B2 patent drawing

AI summary

A memory device includes a memory cell array that a plurality of memory cells, an edge buffer circuit that is placed in a first region adjacent to one side of the memory cell array and receives an external signal from the outside through a pad, and a middle buffer circuit that is placed in a second region adjacent to an opposite side of the memory cell array and receives a differential small-swing signal corresponding to the external signal from the edge buffer circuit through first and second signal lines above the memory cell array. The edge buffer circuit drives the first and second signal lines based on the external signal such that the differential small-swing signal is transmitted to the middle buffer circuit.