Multi-Layer Memory Buffer Synchronization for Latency and Power Reduction
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Solution Overview
Problem
High-performance computing memory systems face issues with memory access latency and power consumption due to point-to-point network connections in cascaded memory buffer device networks, which degrade signal propagation and increase energy requirements.
Innovation Solution
A memory system architecture with synchronized memory buffer devices in multiple layers, utilizing conductive pathways for memory signals, where each layer has reduced outbound links to subsequent layers, and multiple inbound links to the controller, optimizing signal transmission and reducing power consumption by halving the number of output drivers and link complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If point-to-point network connections are used in cascaded memory buffer device networks, then memory access latency increases, but connection reliability is improved
Solution Approach 1:
Multiple memory buffer devices in the same memory layer are merged into a single synchronized group that receives outbound links from the memory controller simultaneously. This consolidation reduces the number of propagation paths and allows parallel signal distribution to multiple buffers, thereby reducing memory access latency while maintaining connection reliability through synchronization mechanisms.
Solution Approach 2:
The patent introduces a new dimensional organization where memory buffer devices are arranged in multiple layers with synchronized groups receiving signals simultaneously. By adding the layer dimension and using parallel outbound links to multiple buffers in each layer, the system reduces the sequential propagation delay inherent in traditional cascaded point-to-point connections.
2Stability of the object's composition
If point-to-point network connections are used in cascaded memory buffer device networks, then connection stability is improved, but power consumption increases
Solution Approach 1:
Multiple output drivers across different memory buffer devices are merged into a single synchronized output stage that drives multiple memory layers simultaneously. This consolidation reduces the total number of output drivers needed, thereby reducing power consumption while maintaining connection stability through precise synchronization of the merged output signals to multiple layers.
Solution Approach 2:
A single synchronized output driver group serves multiple memory layers simultaneously, making the output stage universal rather than dedicated to individual buffers. This multi-functionality reduces the total number of drivers required across the system, lowering overall power consumption while maintaining stable connections to all layers through coordinated signal distribution.
3Loss of time
If synchronized memory buffer devices in multiple layers are used, then memory access latency is reduced, but device complexity increases
Solution Approach 1:
Memory buffer devices perform preliminary synchronization actions by aligning their signal reception and processing timing before actual memory access operations. This pre-synchronization establishes a coordinated timing framework that enables reduced latency during actual operations without requiring complex real-time coordination mechanisms, thereby managing device complexity while achieving latency reduction.
Solution Approach 2:
The system uses feedback mechanisms where memory buffer devices monitor and adjust their synchronization status based on signal timing from the memory controller and from each other. This feedback-based synchronization maintains precise timing coordination across multiple layers, enabling reduced memory access latency while managing device complexity through adaptive rather than purely rigid control.
4Use of energy by moving object
If synchronized memory buffer devices in multiple layers are used, then power consumption is reduced, but link complexity increases
Solution Approach 1:
The patent organizes memory buffer devices in a multi-layer dimensional structure where synchronized groups communicate vertically across layers rather than sequentially through cascaded connections. This dimensional reorganization reduces the number of active output drivers needed (lowering power consumption) while concentrating link complexity into standardized inter-layer connections that can be managed through uniform synchronization protocols.
Data Source
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AI summary
Memory systems are disclosed that include a memory controller and an outbound link with the memory controller connected to the outbound link. The outbound link typically includes a number of conductive pathways that conduct memory signals from the memory controller to memory buffer devices in a first memory layer; and at least two memory buffer devices in a first memory layer. Each memory buffer device in the first memory layer typically is connected to the outbound link to receive memory signals from the memory controller.