Memory Buffer Timing Adjustment for Signal Integrity

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

High-speed data transfer in memory modules is hindered by increased load capacitance, leading to signal quality deterioration, and existing solutions like Fully-Buffered type memory modules are costly due to high-performance Advanced Memory Buffers, while Load Reduced type modules lack optimal timing adjustments.

Innovation Solution

Implementing a controller with pre-launch and post-launch circuits to adjust the output timing of command/address and control signals, respectively, with a fine time adjustment resolution to ensure setup and hold margins, and incorporating a training function for optimal timing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If multiple memory modules are installed to increase memory capacity, then memory capacity is improved, but load capacitance of data line increases and signal quality deteriorates

Engineering Contradiction:
Improvememory capacityVSAvoidsignal quality
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

A buffer chip is introduced as an intermediary component between the memory controller and memory chips. The buffer chip receives data from the memory controller, temporarily stores it, and then supplies it to the memory chips. This intermediary structure isolates the memory controller from the capacitive load of multiple memory modules, reducing the load capacitance seen by the data line and improving signal quality while maintaining high memory capacity.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If Fully-Buffered type memory module with Advanced Memory Buffer is used to reduce load capacitance, then load capacitance of data line is reduced, but cost and power consumption increase

Engineering Contradiction:
Improveload capacitance reductionVSAvoidcost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent changes the operational parameters of the buffer chip, specifically operating it at lower voltage levels (e.g., 1.5V or 1.35V) compared to high-performance Advanced Memory Buffers. This parameter change reduces power consumption and allows the use of less expensive buffer chips while still achieving the required load capacitance reduction for high-speed operation.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs standard, commercially available buffer chips rather than expensive high-performance Advanced Memory Buffers. These conventional buffer chips are more cost-effective and widely available, reducing the overall cost of the memory module while still providing sufficient buffering capability to reduce load capacitance on the data line.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

3Reliability

If Fully-Buffered type memory module with Advanced Memory Buffer is used, then load capacitance is reduced, but interface compatibility with memory controller is lost

Engineering Contradiction:
Improveload capacitance reductionVSAvoidinterface compatibility
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The buffer chip is designed with universal interfaces that are compatible with standard memory controller protocols. The buffer chip can interface with conventional memory controllers using standard signaling, maintaining compatibility and allowing off-the-shelf memory controllers to be used. This universal design enables the buffer to work with various memory controller implementations without requiring specialized interfaces.

Inventive Principle:
Principle #6Universality (Multi-functionality)

4Productivity

If high data transfer rate is implemented, then productivity is improved, but signal quality deteriorates due to load capacitance

Engineering Contradiction:
Improvedata transfer rateVSAvoidsignal quality
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The buffer chip performs preliminary actions by pre-charging and pre-conditioning data signals before they are transmitted to the memory chips. It also pre-manages the timing and sequencing of data transfers, preparing signals in advance to compensate for the effects of load capacitance. This preliminary action ensures that signals arrive at the memory chips with adequate timing margins and voltage levels, enabling high-speed operation without signal integrity issues.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS8347057B2Memory module
Publication Date: 2013.01.01 LONGITUDE LICENSING LTD
  • US8347057B2 patent drawing
  • US8347057B2 patent drawing
  • US8347057B2 patent drawing

AI summary

A memory buffer mounted on a memory module includes a pre-launch function of advancing outputs of address/command signal and a post-launch function of delaying outputs of control signal. A time step increment for pre/post-launch time adjustment is set to be equal to or finer than tCK/32 where tCK is one clock cycle.