Memory Card Adapter Signal Routing and Return Path Design
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Solution Overview
Problem
Existing memory card adapters are not suitable for high-speed operations due to limitations in signal routing and data skew adjustments, particularly because they often lack a dedicated return path for signal lines, which can lead to interference from adjacent signal lines and difficulties in accommodating various memory card standards.
Innovation Solution
A memory card adapter with a package substrate that includes separate return paths for signal lines, allowing for non-adjacent signal line routing and multiple layers to adjust data skew, along with a conduction plate connected to ground pins to form a low-impedance return path, and a pin-to-pin structure that includes insulation and conduction plates for efficient signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional memory card adapter structure is used, then the adapter can accommodate various memory card types, but signal interference occurs and high-speed operations are not supported
Solution Approach 1:
The adapter structure is segmented into distinct functional layers: a package substrate layer for signal routing, a return path layer for dedicated signal return, and a memory card interface layer. This segmentation allows independent optimization of signal paths and return paths, preventing interference between adjacent signals while maintaining compatibility with various memory card types.
Solution Approach 2:
A dedicated return path structure acts as an intermediary between signal lines and ground, providing a controlled impedance path for signal return currents. This intermediary structure isolates signal return paths from adjacent signal lines, eliminating cross-talk and interference while enabling high-speed operations.
2Volume of moving object
If signal lines are routed adjacently to save space, then the adapter structure is compact, but signal interference increases
Solution Approach 1:
The return path is implemented as a separate dimensional layer beneath the signal lines, rather than placing return paths adjacently in the same plane. This vertical dimensional separation allows compact horizontal routing while maintaining electromagnetic isolation between signal lines and return paths, reducing interference without increasing adapter volume.
3Ease of manufacture
If a simple pin structure is used, then the adapter is easy to manufacture, but data skew adjustment is difficult
Solution Approach 1:
The adapter incorporates adjustable timing control structures that allow dynamic compensation for data skew during operation. Rather than requiring precise fixed manufacturing tolerances, the design enables post-manufacturing adjustment of signal timing through controllable path length variations or delay elements, maintaining ease of manufacture while achieving precise data alignment.
4Device complexity
If return paths are not provided for signal lines, then the adapter structure is simple, but signal interference from adjacent lines occurs
Solution Approach 1:
The return path structure is merged with the package substrate ground plane, creating a unified low-impedance return path that spans multiple layers. This integration provides comprehensive signal return paths for all signal lines without requiring separate discrete return path components, maintaining structural simplicity while effectively preventing signal interference.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables high-speed memory card operations by minimizing signal interference and allowing for flexible data skew adjustments, making the adapter suitable for various memory card types and standards.
Implementation Method 1
a conduction plate connected to ground pins to form a low-impedance return path
Data Source
AI summary
A memory card adapter includes a body having a set of contact pins. The set of contact pins include input pins and output pins implemented in a pin-to-pin structure. The input pins connect with pins of an inserted memory card and the output pins connect with an external socket. The body includes a bottom lead adapted to support the main body, and a top lead adapted to be combined with the bottom lead. The body includes a fixing substance adapted to combine with the contact pins. The body includes a conduction plate on a top surface or a bottom surface of the fixing substance, where the conduction plate is connected to at least one of the contact pins.