Memory Card Ultrasonic Bonding Director Placement
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Solution Overview
Problem
Existing memory card designs using ultrasonic bonding methods often result in thickness variations due to insufficient melting of energy directors, leading to bulges and operational issues such as unconformity with standards, difficulty in insertion/removal, and potential damage.
Innovation Solution
The strategic placement of energy directors along the edges of the memory card case, excluding the recessed area and groove regions, ensures effective ultrasonic bonding without bulges by optimizing the distance and positioning to ensure complete melting and uniform thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If ultrasonic bonding method is used to weld upper case and lower case, then bonding strength is improved, but thickness variation and bulges occur due to insufficient melting of energy directors
Solution Approach 1:
The patent applies local quality by strategically positioning energy directors only at specific locations (edge portions excluding recessed areas) rather than uniformly distributing them. This localized placement ensures adequate melting and bonding strength at critical edges while preventing bulges in recessed areas where energy directors would cause thickness variations.
Solution Approach 2:
The bonding process is segmented by dividing the case perimeter into different zones: edge portions where energy directors are placed for strong bonding, and recessed areas where energy directors are excluded to prevent bulges. This segmentation allows different bonding characteristics in different regions.
2Strength
If energy directors are placed along all edge portions, then bonding strength is improved, but bulges occur in recessed areas causing operational issues
Solution Approach 1:
Energy directors are selectively placed only at edge portions excluding recessed areas, giving different bonding characteristics to different locations. This local differentiation maintains bonding strength where needed while preventing bulges that would interfere with slot insertion and removal operations.
Solution Approach 2:
The patent converts the potential harm of energy directors causing bulges in recessed areas into a benefit by deliberately excluding them from those areas. This exclusion prevents the harmful effect while maintaining bonding strength at edge portions, thereby ensuring smooth insertion and removal operations.
3Ease of manufacture
If energy directors are melted during ultrasonic bonding, then bonding is achieved, but thickness variation occurs leading to non-conformity with standards
Solution Approach 1:
The patent implements local quality by allowing energy director melting (and associated thickness variation) only at edge portions where it contributes to bonding strength, while excluding recessed areas where melting would create unacceptable thickness variations. This localized approach satisfies both manufacturing processability and precision requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces thickness variations, enhances reliability, and maintains the memory card's standard conformity, improving operability and preventing damage.
Implementation Method 1
The upper case and the lower case are welded, for example, by ultrasonic bonding method
Implementation Method 2
insufficient melting of energy directors
Data Source
AI summary
According to one embodiment, a memory card includes a first case including a first surface, the first surface including a groove, and the first case including a recessed area, a second case including a second surface, the second case being bonded to the first case, a memory disposed between the first case and the second case, a write-protect switch disposed between the first case and the second case and disposed in the recessed area, and a first director disposed between the first case and the second case, the first director being provided along an edge portion of the first case or the second case excluding the recessed area.