Memory Card Marking Layer Through-Hole Visibility
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Solution Overview
Problem
Memory cards face challenges in improving visibility of product information marking, which affects user identification and manufacturing costs due to limited material selection and potential physical deformation like warpage.
Innovation Solution
A memory card design featuring a case with a second case portion having through-holes for product information display, a marking layer exposed through these holes, and a metal marking layer for enhanced visibility and reduced production costs, allowing for varied material selection without color restrictions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a marking layer is applied on the case surface to display product information, then visibility of product information is improved, but manufacturing complexity increases and material selection is limited
Solution Approach 1:
The patent extracts the marking layer from the traditional surface printing method and forms it as a separate raised structure through molding. This allows the marking information to be physically extracted from the case surface, creating a distinct marking layer that can be molded separately and then assembled, thereby reducing manufacturing complexity while maintaining visibility.
Solution Approach 2:
The marking layer is nested within the case structure, forming a raised marking area that is integrated into the overall case design. The marking layer is positioned between the first and second case portions, creating a nested configuration that reduces the number of separate components while maintaining the visibility function.
2Ease of manufacture
If traditional marking methods are used, then manufacturing process is simple, but material selection is limited and warpage occurs
Solution Approach 1:
The case is segmented into multiple portions (first case portion, second case portion, and marking layer) that can be manufactured separately using different materials. This segmentation allows each portion to be optimized for its specific function and material requirements, enabling greater material selection flexibility while maintaining manufacturing simplicity through modular assembly.
Solution Approach 2:
The patent employs composite material construction by combining different materials for the first case portion, second case portion, and marking layer. This allows selection of materials with appropriate properties for each component, such as using materials with different thermal expansion coefficients to prevent warpage while maintaining ease of manufacture through separate molding processes.
3Ease of manufacture
If uniform case material is used, then manufacturing is easier, but visibility of marking information is insufficient
Solution Approach 1:
The patent applies local quality by creating a marking layer with distinct properties from the surrounding case portions. The marking layer is formed with raised markings and different material characteristics in the specific area where product information needs to be displayed, while the rest of the case maintains uniform material properties for ease of manufacture. This localized differentiation enhances visibility without complicating the overall manufacturing process.
Data Source
AI summary
A memory card includes a case including a first case portion and a second case portion that is coupled to the first case portion, an integrated circuit package located in the case, and a marking layer located in the case, wherein the second case portion includes a through-hole, wherein the marking layer is exposed to an outside through the through-hole.