Memory Card Module Chamfered Cavity Design for Adhesive Leakage
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Solution Overview
Problem
Memory cards face issues with adhesive leakage and positional variability due to insufficient tolerances between the module and the case, leading to contamination and potential non-compliance with electrostatic current regulations.
Innovation Solution
The memory card module is uniquely configured with chamfers and minimized facial clearances to prevent adhesive leakage, ensuring secure adhesion and alignment within the case, using a combination of chamfers and precise cavity design to guide the module and enhance adhesive contact area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a gap of at least 0.15 millimeters is provided between the module and the cavity wall to enable smooth insertion, then the module can be easily inserted into the case, but adhesive will flow through the gaps and leak out of the cavity
Solution Approach 1:
The cavity is designed with non-uniform cross-sectional dimensions, creating regions of different clearance sizes. The facial clearances (front and rear) are minimized to prevent adhesive leakage, while lateral clearances are maintained for insertion guidance. This local differentiation of clearance characteristics resolves the contradiction between smooth insertion and adhesive containment.
Solution Approach 2:
The invention transitions from considering only lateral clearances to incorporating facial clearances (front and rear dimensions) as additional control parameters. By optimizing clearances in multiple dimensions differently, the design achieves both smooth insertion (through lateral gaps) and adhesive leakage prevention (through minimized facial gaps).
2Ease of operation
If a gap of about 0.15 millimeters is maintained between the module and the cavity wall, then the module can be inserted smoothly, but the position of the I/O pads becomes variable and may not meet electrostatic current regulations
Solution Approach 1:
Different regions of the cavity are designed with different clearance characteristics. Lateral clearances are maintained to allow insertion, while facial clearances are minimized to constrain the module's final position. This local differentiation ensures both operational ease and manufacturing precision.
Solution Approach 2:
The invention replaces reliance on uniform mechanical tolerances with a geometric constraint system. The non-uniform cavity geometry actively guides and constrains the module position, substituting passive tolerance accumulation with active geometric control to achieve precise I/O pad alignment.
3Ease of operation
If the module is allowed to deflect to one side of the cavity for smooth insertion, then insertion is facilitated, but a gap of about 0.30 millimeters forms at the opposite side creating a visible defect
Solution Approach 1:
The cavity is designed with asymmetric clearance distribution optimized for insertion direction. Facial clearances are minimized to prevent visible gaps when the module is properly positioned, while lateral clearances allow controlled deflection during insertion. This local differentiation resolves the contradiction between insertion ease and appearance.
4Ease of operation
If larger clearances are provided between the module and cavity wall, then the module can be inserted more easily and position variability is reduced, but adhesive leakage increases and visible gaps are created
Solution Approach 1:
The cavity design implements spatially varying clearance characteristics: lateral regions have larger clearances for insertion ease, while facial regions have minimized clearances to prevent adhesive leakage. This local quality differentiation allows the system to achieve both insertion ease and adhesive containment simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents adhesive leakage, ensures precise alignment, and increases adhesion strength, eliminating the need for expensive film adhesives and reducing visible gaps, thus enhancing the external appearance and functional reliability of memory cards.
Implementation Method 1
The module is secured within the cavity of the case through the use of an adhesive
Data Source
AI summary
In accordance with the present invention, there is provided multiple embodiments of a memory card, each embodiment including a module comprising at least a printed circuit board having an electronic circuit device mounted thereto. The module is inserted into a complementary cavity formed within a case of the memory card, such case generally defining the outer appearance of the memory card. The module is secured within the cavity of the case through the use of an adhesive. In each embodiment of the present invention, the module is uniquely configured to prevent adhesive leakage from within the corresponding cavity of the case of the memory card when the module is secured within the cavity.