Memory Card Socket Terminals Embedded in Molding Layer
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Solution Overview
Problem
There is a need for memory cards that perform high-speed input/output operations while maintaining improved stability and reliability, and for memory card sockets that can accommodate these cards effectively, with manufacturing methods that ensure easy and stable production.
Innovation Solution
The memory cards feature a printed circuit board with external connection terminals, stacked memory devices, a memory controller, and a molding layer that encapsulates the components, along with second external connection terminals embedded in the molding layer for electrical connectivity. The memory card sockets include specific terminals for power supply and data input/output, designed to accommodate these cards and enhance data transmission reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If memory cards operate at high speed, then data transmission rate is improved, but stability and reliability deteriorate
Solution Approach 1:
The patent transitions from a single-plane terminal arrangement to a three-dimensional configuration by embedding terminals within the molding layer. This spatial reorganization allows for optimized signal paths and reduced interference, enabling high-speed operation while maintaining stability through improved physical layout and electrical isolation.
Solution Approach 2:
The molding layer serves as an intermediary structure that houses and protects the second external connection terminals. This intermediate layer provides mechanical support, electrical isolation, and structural integrity, allowing the memory card to achieve high-speed performance while maintaining reliable connections through the protected terminal architecture.
2Productivity
If multiple external connection terminals are added for high-speed operation, then data transmission capability is improved, but device complexity increases
Solution Approach 1:
The patent combines multiple terminal functions into a unified molding layer structure. The second external connection terminals are integrated within the same molding layer that protects the memory devices and controller, creating a consolidated assembly that reduces overall device complexity while enabling high-speed multi-terminal operations.
Solution Approach 2:
The molding layer serves multiple functions simultaneously: it protects the memory devices and controller, houses the second external connection terminals, provides structural support, and enables both high-speed data transmission and power supply functions through its integrated terminal configuration.
3Adaptability or versatility
If external connection terminals are exposed on both main surfaces, then connectivity options are improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent segments the terminal arrangement by function and surface: first external connection terminals are exposed on the first main surface while second external connection terminals are embedded in the molding layer on the second main surface. This segmentation allows each terminal group to be optimized independently for its specific function, reducing overall manufacturing precision requirements while maintaining versatile connectivity.
Data Source
AI summary
A memory card comprising a first main surface and a second main surface opposing each other, and including a printed circuit board (PCB) constituting the first main surface, the PCB including a plurality of first external connection terminals, the plurality of first external connection terminals exposed on the first main surface, a plurality of memory devices stacked on the PCB, a memory controller configured to control the plurality of memory devices, a molding layer encapsulating the plurality of memory devices and the memory controller, the molding layer constituting the second main surface, and one or more second external connection terminals electrically connected to the memory controller, the one or more second external connection terminals embedded in the molding layer and exposed by the molding layer on the second main surface may be provided.