Memory Card Pad Layout and Lock Mechanism for Hot Insertion
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Solution Overview
Problem
Existing memory cards, such as microSD™ cards, have a form factor that is too small to handle high performance demands and thermal conditions, limiting their capacity and functionality in mobile computing devices.
Innovation Solution
The development of memory cards with larger dimensions and innovative pad layouts that support higher performance, thermal capabilities, and include a metal plate for heat dissipation and EMI protection, along with a new card lock mechanism to ensure efficient insertion and removal without electrical conflicts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the memory card form factor is increased to support higher memory capacity and thermal capabilities, then the memory capacity and thermal management improve, but the device size increases
Solution Approach 1:
The patent transitions from the traditional microSD card form factor to a larger form factor that utilizes additional dimensional space. This allows for increased memory capacity, improved thermal management through larger heat dissipation surfaces, and better pad layout configurations while maintaining compatibility with mobile computing devices.
2Temperature
If the memory card form factor is increased to support higher performance demands, then the thermal management improves, but the card size increases
Solution Approach 1:
By adopting a larger form factor, the patent provides increased surface area for thermal management. The expanded card dimensions allow for larger pad areas that can dissipate heat more effectively, supporting higher performance demands while maintaining manageable device dimensions.
3Reliability
If the pad layout is modified to avoid electrical conflicts during hot insertion/removal, then the reliability improves, but the manufacturing precision requirements increase
Solution Approach 1:
The patent employs an asymmetric pad layout configuration on the larger form factor card. This asymmetric arrangement strategically positions pads to prevent electrical conflicts during hot insertion and removal operations. The unequal spacing and positioning of pads across different regions of the card surface ensures that no electrical conflicts occur while maintaining manufacturability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for higher capacity, better thermal characteristics, and improved performance by avoiding electrical conflicts during hot insertion/removal, while maintaining compatibility with existing connectors and reducing production complexity.
Implementation Method 1
the use of a metal plate for heat dissipation
Implementation Method 2
the use of a metal plate for heat dissipation and EMI protection
Data Source
AI summary
A memory card is provided with various pad layouts to prevent a data signal pad from contacting a power contact in a host during insertion and removal of the memory card. The memory card can have a form factor and features that accommodate a relatively-large memory with relatively-high performance and accompanying thermal conditions. An efficient card lock mechanism is also provided.