Memory Card Pad Layout and Lock Mechanism Design
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Solution Overview
Problem
Existing memory cards, such as microSD™ cards, have a form factor that is too small to handle high performance demands and thermal conditions, limiting their capacity, performance, and thermal management capabilities.
Innovation Solution
The development of memory cards with larger dimensions and specific pad layouts that support higher memory, performance, and thermal capabilities, including the use of a metal plate for heat dissipation and EMI protection, and innovative pad arrangements to avoid electrical conflicts during hot insertion/removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the memory card form factor is increased to handle high performance demands and thermal conditions, then thermal management capability and memory capacity are improved, but the card size and profile increase
Solution Approach 1:
The patent applies local quality by implementing a non-uniform thickness profile across the card body, with a first thickness in the region adjacent to the lock mechanism and a second thickness in other regions. This localized variation allows thermal management components to be concentrated where needed while maintaining an overall compact form factor. The metal plate is also strategically positioned to provide localized heat dissipation rather than requiring uniform thickness throughout the entire card.
2Productivity
If the memory card form factor is increased to handle high performance demands, then performance capability is improved, but the card size increases
Solution Approach 1:
The patent utilizes the thickness dimension to accommodate high-performance components without increasing the card's length or width. By varying the thickness strategically - particularly thickening the region adjacent to the lock mechanism - the design fits additional memory capacity and performance-enhancing components within the constrained planar dimensions, effectively using the third dimension to resolve the performance-size contradiction.
3Temperature
If a metal plate is added for heat dissipation and EMI protection, then thermal management and EMI shielding are improved, but the card weight and complexity increase
Solution Approach 1:
The metal plate is implemented as a localized thermal management solution rather than a full-card construction. It is positioned specifically in regions requiring heat dissipation and EMI protection, allowing effective thermal management without the weight penalty of a complete metal enclosure. This localized approach provides the necessary heat dissipation capability while minimizing the overall weight increase.
4Reliability
If pad layout is optimized to avoid electrical conflicts during hot insertion/removal, then reliability is improved, but the manufacturing complexity increases
Solution Approach 1:
The pad layout is designed in advance to pre-emptively avoid electrical conflicts during hot insertion and removal operations. By carefully planning the pad positions and orientations before manufacturing, the design ensures that pads are not positioned in ways that would cause short circuits or electrical interference during card insertion or removal. This preliminary design approach prevents reliability issues without requiring complex manufacturing processes, as the conflict avoidance is built into the fundamental layout rather than added through complex manufacturing steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed memory cards address the limitations of existing cards by providing a larger form factor that allows for higher capacity, improved thermal management, and enhanced performance, while also preventing electrical conflicts during card insertion and removal.
Implementation Method 1
the use of a metal plate for heat dissipation
Implementation Method 2
the use of a metal plate for heat dissipation and EMI protection
Data Source
AI summary
A memory card is provided with various pad layouts to prevent a data signal pad from contacting a power contact in a host during insertion and removal of the memory card. The memory card can have a form factor and features that accommodate a relatively-large memory with relatively-high performance and accompanying thermal conditions. An efficient card lock mechanism is also provided.