Semiconductor Memory Card Resin Recess for Terminal Exposure
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Solution Overview
Problem
The challenge in manufacturing semiconductor memory cards is the difficulty in preventing or controlling the generation of resin burrs during the molding process, which often results in external connection terminals being covered by resin, leading to diminished connectivity with external devices.
Innovation Solution
The solution involves forming a recess portion in the sealing resin layer around the external connection terminals, which exposes their surface and side surfaces, and using techniques like laser irradiation or plasma processing to create this recess, ensuring the terminals remain accessible while the rest of the components are sealed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If transfer molding is used to form the sealing resin layer, then the semiconductor chips and chip components are sealed effectively, but resin burrs are generated and external connection terminals are covered by resin
Solution Approach 1:
The patent divides the sealing resin layer into different functional regions: a first region that seals the semiconductor chips and chip components, and a second region that exposes the external connection terminals. This segmentation allows the molding process to achieve both effective sealing and precise terminal exposure simultaneously, resolving the contradiction between sealing reliability and terminal exposure precision.
2Ease of manufacture
If external connection terminals are configured on one side of the sealing resin layer surface, then manufacturing is simplified, but it becomes difficult to prevent or control resin burr generation
Solution Approach 1:
The patent applies local quality by creating a specific regional structure within the sealing resin layer: the first region provides sealing function while the second region provides terminal exposure function. This localized functional differentiation maintains the simplicity of single-side terminal configuration while achieving precise terminal exposure without resin burrs, resolving the contradiction between manufacturing simplicity and manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively exposes the external connection terminals, enhancing their functionality and stability, and reduces the cost of the memory card by improving the exposure and reliability of the terminals, thus ensuring full functionality and reliable connection to external devices.
Implementation Method 1
the sealing resin layer is formed through application of transfer molding or the like using a molding that can expose the surface of external connection terminals
Implementation Method 2
using techniques like laser irradiation or plasma processing to create this recess
Implementation Method 3
using techniques like laser irradiation or plasma processing to create this recess
Data Source
AI summary
A semiconductor memory card includes a lead frame having external connection terminals, a controller chip mounted on the lead frame and a memory chip mounted on the lead frame. The lead frame, the controller chip, and the memory chip are sealed with a sealing resin layer that has a surface at which the external connection terminals are exposed and a recess surrounding the external connection terminals.