Memory Card Structure with Sealing Layer and Metal Shells
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Solution Overview
Problem
Existing memory card structures face challenges in durability and waterproofing, particularly around the electrical contact part, and lack effective thermal dissipation.
Innovation Solution
The structure incorporates a circuit substrate with connecting holes around the electrical contact part, filled with the same material as the insert molding for enhanced sealing and fixation, and uses metal components for the top and bottom shells to improve durability and thermal dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the electrical contact part uses thin metal layers with small spacing, then the memory card can be made more compact, but the structure around the electrical contact part becomes fragile
Solution Approach 1:
The patent applies preliminary action by pre-positioning reinforcing structures (such as support ribs or strengthened substrate regions) around the electrical contact areas before final assembly. This prevents fragility from developing during use, allowing thin metal layers to be used while maintaining structural integrity around the contact regions.
Solution Approach 2:
The patent implements local quality by creating non-uniform structural properties - the regions around electrical contacts are specifically reinforced with thicker materials or additional support structures, while other areas of the memory card can remain compact and lightweight. This localized reinforcement strengthens vulnerable areas without significantly increasing overall size.
2Ease of manufacture
If traditional sealing methods are used for memory cards, then manufacturing is simpler, but sealing and fixation capability is insufficient
Solution Approach 1:
The patent employs composite materials by combining different materials with complementary properties - such as combining rigid structural materials with flexible sealing materials, or combining materials with different thermal expansion coefficients to maintain seal integrity under temperature variations. This multi-material approach enhances sealing capability while remaining compatible with existing manufacturing processes.
Solution Approach 2:
The patent applies the nesting principle by creating multi-layered sealing structures where sealing elements are embedded within or between structural layers. This nested configuration provides redundant sealing paths and maintains fixation capability without adding significant manufacturing complexity, as the sealing function is integrated into the existing layered structure.
3Temperature
If metal materials are used for top and bottom shells, then thermal dissipation is improved, but manufacturing complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the shell structure into distinct functional zones - metal materials are used specifically in regions requiring thermal dissipation (such as areas adjacent to memory chips), while other regions may use lighter or less expensive materials. This segmented approach improves thermal management where needed without unnecessarily increasing manufacturing complexity across the entire shell structure.
Solution Approach 2:
The patent implements universality by designing the metal shell components to serve multiple functions simultaneously - providing structural support, enabling thermal dissipation, and facilitating assembly through integrated features. This multi-functionality reduces the need for separate components, thereby limiting the increase in manufacturing complexity while achieving improved thermal performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a memory card with improved durability, enhanced sealing, increased waterproofing, and effective thermal dissipation, ensuring robustness and efficient heat management.
Implementation Method 1
The covering layer is formed directly on the circumference and the seam of the top shell, bottom shell, and circuit substrate, and fills the connecting holes to engage the top shell and the bottom shell
Implementation Method 2
By replacing part of the area on the top shell and bottom shell with a metal material, the heat generated by the memory chip operation can be effectively dissipated through the metal areas on the top and bottom shells of the memory card
Data Source
AI summary
A structure for memory card is provided, including a bottom shell, a circuit substrate, a top shell, and a covering layer. The bottom shell includes a base seat of a smaller area size. The circuit substrate includes a first surface and an opposite second surface. The first surface includes chips and circuits, and the second surface includes an electrical contact part. The chips and the circuits are connected to the electrical contact part. The circuit substrate also includes a plurality of connecting holes. The connecting holes are preferably located around the electrical contact part. The circuit substrate is attached to the base seat of the bottom shell on the first surface, and the top shell covers the second surface of the circuit substrate, with the electrical contact part exposed. The covering layer is formed directly on the circumference and the seam of the top shell, bottom shell, and circuit substrate, and fills the connecting holes to engage the top shell and the bottom shell. The covering layer forms the memory card of a standard physical specification.