Memory Card Socket Shielding via Sliding Conductive Cover
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Solution Overview
Problem
Memory card sockets face challenges in reliability due to increased demands for large capacity, high integration, and fast operation, particularly in shielding against electromagnetic interference and ensuring secure card insertion and removal.
Innovation Solution
A memory card socket design featuring a substrate with a ground pattern, a conductive housing, and a conductive cover that moves between open and closed positions, utilizing a conductive connector with solder material to securely attach the housing to the substrate and shield electromagnetic interference, while ensuring reliable card insertion and operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional memory card socket structure is used, then the device complexity is low, but the reliability and electromagnetic interference shielding are insufficient
Solution Approach 1:
The memory card socket is divided into multiple functional components: a conductive housing forming an insertion space, a conductive cover that moves between open and closed positions, a conductive connector for electrical connection, and a ground pattern on the substrate. This segmentation allows each component to perform its specific function optimally, improving overall reliability while maintaining manageable complexity through modular design
Solution Approach 2:
The conductive cover is nested within the conductive housing structure, moving between positions to open or close the insertion space. The conductive connector is nested between the ground pattern and the conductive housing, creating a layered nested arrangement that enhances electromagnetic shielding and electrical connectivity without significantly increasing external device complexity
2Object-affected harmful factors
If the conductive cover is always closed, then electromagnetic interference shielding is improved, but card insertion and removal operations become difficult
Solution Approach 1:
The conductive cover is designed as a dynamic component that can move between a first position (opening the insertion space for card insertion/removal) and a second position (closing the insertion space for electromagnetic shielding). This dynamic capability allows the structure to adapt its state based on operational requirements, providing both ease of operation and effective electromagnetic interference protection
Solution Approach 2:
The conductive cover provides preliminary electromagnetic shielding protection by default in the closed position, preventing electromagnetic interference before it can affect the memory card. When card operations are needed, the cover temporarily opens to allow access, then closes again to restore protection, creating a cycle of preliminary anti-action against electromagnetic harmful factors
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances the reliability of memory card sockets by effectively shielding electromagnetic interference and ensuring secure card operations through the conductive cover's ability to close the insertion space, thereby improving the overall performance and durability of the memory card socket.
Implementation Method 1
the conductive connector includes a solder material
Implementation Method 2
a conductive housing on the ground pattern and having an insertion space; a conductive cover coupled to the conductive housing, wherein the conductive cover is configured to move from a first position, at which the conductive cover externally opens the insertion space, to a second position, at which the conductive cover closes the insertion space
Data Source
AI summary
An electric apparatus includes a substrate having a ground pattern on a top surface of the substrate; a conductive housing on the ground pattern and having an insertion space; a conductive connector disposed between the ground pattern and the conductive housing and connected to the ground pattern and the conductive housing, wherein the conductive housing is fixed to the substrate via the conductive connector; and a conductive cover coupled to the conductive housing, wherein the conductive cover is configured to move from a first position, at which the conductive cover externally opens the insertion space, to a second position, at which the conductive cover closes the insertion space.