Memory Card Socket Protrusion Heat Dissipation
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Solution Overview
Problem
Memory card sockets face challenges in efficiently dissipating heat generated by memory cards, particularly those with higher operational speeds, leading to increased temperatures due to limited contact areas between metal terminals and pads.
Innovation Solution
Incorporating a protrusion made of high thermal conductivity material on the memory card socket substrate, which contacts the memory card and serves as a heat sink, along with a metal layer buried under the protrusion to enhance heat dissipation, allowing for wider contact areas and improved thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If memory cards operate at higher speeds, then data exchange efficiency is improved, but heat generation increases and temperature rises
Solution Approach 1:
The patent introduces a protrusion as an intermediary heat dissipation component between the memory card and the substrate. This protrusion contacts the memory card body and provides an additional heat conduction path, acting as a mediator to transfer heat away from the memory card without interfering with the electrical connection function.
Solution Approach 2:
The patent adds heat dissipation in another dimension by extending the heat conduction path from the traditional two-dimensional pad-terminal contact to include a three-dimensional protrusion structure. This protrusion creates a new heat transfer dimension that contacts the memory card body, expanding the heat dissipation pathways beyond the electrical contact points.
2Reliability
If contact area between metal terminals and pads is increased, then electrical connectivity is improved, but heat dissipation capability worsens due to limited surface area
Solution Approach 1:
The patent segments the heat dissipation function from the electrical connection function. The metal terminals maintain their original size and shape for reliable electrical connectivity, while a separate protrusion structure handles heat dissipation. This segmentation allows each component to optimize its specific function without compromising the other.
Solution Approach 2:
The protrusion serves as an intermediary heat dissipation component that does not interfere with the metal terminal-pad electrical connection. It provides an additional heat conduction path by contacting the memory card body, effectively separating the heat dissipation pathway from the electrical connection pathway.
3Loss of energy
If protrusion size is increased to enhance heat dissipation, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The patent merges the heat dissipation function with the existing substrate structure by forming the protrusion directly on the substrate. This integration approach combines multiple functions (electrical connection via metal terminals and heat dissipation via protrusion) into a unified socket structure, reducing overall device complexity compared to adding separate heat dissipation components.
Solution Approach 2:
The substrate is designed to serve multiple functions: providing electrical connection through metal terminals and heat dissipation through the protrusion. This multi-functionality reduces the need for additional separate components, thereby simplifying the overall device structure while achieving effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The protrusion effectively dissipates heat from the memory card, preventing the metal terminals and pads from overheating and ensuring efficient data exchange while maintaining electrical connectivity.
Implementation Method 1
a protrusion provided on a first face, having a second face that contacts a portion of the memory card that excludes the terminal, and including a metal material or an insulating material
Data Source
AI summary
A memory card socket includes a first pad provided in a first face of a first substrate; a first terminal having a first end portion that contacts a terminal of a memory card and a second end portion electrically connected to the first pad; a holder provided on the first face and fixing the first terminal to the first substrate; and a protrusion provided on the first face, having a second face that contacts a portion of the memory card that excludes the terminal, and including a metal material or an insulating material.