Memory Card Thermal Interface for Speed-Aware Heat Dissipation

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Solution Overview

Problem

Existing memory cards and host devices lack effective heat dissipation management, leading to inefficient performance in high-speed data processing and potential overheating issues.

Innovation Solution

A memory card that includes a heat dissipator and a processor to provide heat dissipator information to the host device, allowing for dynamic adjustment of data processing speeds based on heat dissipation performance, using a connector with a heat absorber to enhance thermal conductivity and manage heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If data processing speed is increased in memory card, then productivity is improved, but heat generation increases causing overheating issues

Engineering Contradiction:

Improvedata processing speedVSAvoidheat generation

Core Design Contradiction:

ProductivityVSTemperature

Solution Approach 1:

A heat dissipator is introduced as an intermediary component between the memory card's data processing units and the external environment. The heat dissipator includes a heat conduction unit that contacts the memory card body and a heat radiation unit that extends to the outside, creating a thermal bridge that efficiently transfers heat away from the memory card during high-speed data processing operations

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent replaces passive thermal management with an active information exchange system. The memory card transmits heat dissipator information (material, shape, position) to the host device, enabling the host device to dynamically adjust data processing speeds based on thermal conditions, substituting mechanical thermal conduction with intelligent control

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Temperature

If heat dissipator structure is added to memory card, then heat dissipation performance is improved, but device complexity increases

Engineering Contradiction:

Improveheat dissipation performanceVSAvoidstructure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The heat dissipator is merged with the memory card body through direct contact or integration into the connector interface. The heat conduction unit is positioned to contact the memory card body, combining thermal management functionality with the existing memory card structure rather than adding completely separate components

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The heat dissipator applies local quality by concentrating thermal management resources where heat generation is most intense. The heat conduction unit is positioned at specific locations within the memory card body to target high-heat areas, and the heat radiation unit extends in directions optimized for thermal discharge from critical components

Inventive Principle:

Principle #3Local quality

3Temperature

If host device adjusts data processing speed dynamically, then heat dissipation performance is improved, but control complexity increases

Engineering Contradiction:

Improveheat dissipation performanceVSAvoidcontrol complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The memory card proactively transmits heat dissipator information to the host device before data processing begins. This preliminary action provides the host device with advance knowledge of the memory card's thermal management capabilities, enabling informed speed adjustments without requiring complex real-time thermal monitoring and control algorithms

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The system establishes a feedback loop where the memory card provides heat dissipator information to the host device, which then adjusts data processing speeds accordingly. This feedback mechanism enables adaptive thermal management, where processing speed is modulated based on the actual heat dissipation capabilities of the specific memory card installed

Inventive Principle:

Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables the host device to determine and adjust data processing speeds according to the memory card's heat dissipation capabilities, ensuring optimal performance and preventing overheating by calculating heat dissipation performance based on the position and material of the heat dissipator.

Implementation Method 1

a connector (103) into which the memory card (101) is inserted, is provided with a heat absorber (104)

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a heat dissipator for releasing heat in the memory card

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Implementation Method 3

a heat dissipator for releasing heat in the memory card

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS20250004448A1Memory card and host device

Publication Date: 2025.01.02 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD

AI summary

A memory card is configured to be inserted into and removed from a connector provided in a host device, and includes: a memory that stores heat dissipator information on a heat dissipator of the memory card; and a processor that returns a response including the heat dissipator information in response to a command for inquiring heat dissipation performance transmitted from the host device.