Memory Card Case Grooves for Warpage-Resistant Packaging
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Solution Overview
Problem
Memory cards face challenges in achieving high reliability and productivity due to warpage issues, which affect their performance and manufacturing efficiency.
Innovation Solution
A memory card design featuring a case with recessed grooves and a compact integrated circuit package that reduces warpage, enhancing reliability and productivity by optimizing the package's size and structure within the case.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the integrated circuit package size is reduced to enhance productivity, then manufacturing efficiency improves, but warpage control becomes more difficult affecting reliability
Solution Approach 1:
The case structure incorporates localized recessed grooves at specific edges and corners, creating non-uniform structural properties that locally compensate for warpage stresses in the reduced-size integrated circuit package, thereby maintaining reliability while enabling smaller dimensions for improved productivity
2Productivity
If the integrated circuit package is made smaller for better productivity, then production efficiency increases, but the package structure becomes more susceptible to warpage
Solution Approach 1:
The solution transitions from two-dimensional planar case structures to three-dimensional recessed grooves with varying depths and positions, creating a multi-level structural configuration that provides enhanced warpage compensation capability for smaller integrated circuit packages without compromising production efficiency
3Reliability
If recessed grooves are added to the case to reduce warpage, then reliability improves, but device complexity increases
Solution Approach 1:
The case structure is segmented into multiple edges with selectively positioned recessed grooves at specific locations (first edge, second edge, third edge, and fourth edge), allowing warpage compensation to be achieved through distributed localized features rather than a single complex overall structure, thereby balancing reliability improvement with manageable device complexity
Data Source
AI summary
A memory card includes a case and an integrated circuit package disposed in the case. The case includes a first case edge, a second case edge connected to the first case edge, a third case edge connected to the second case edge, a fourth case edge connected to the third case edge and the first case edge, and a first recessed groove formed in the second case edge, the first recessed groove being spaced apart from the first case edge and inwardly recessed. The integrated circuit package is disposed in an upper portion of the case between the first case edge and a first horizontal line that extends in a direction from a top end of the first recessed groove in the second case edge to the fourth case edge.