Memory Test Cartridge With Vacuum Thermal Conduction Heating
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Solution Overview
Problem
Conventional convection oven-based testing systems for memory devices suffer from large temperature gradients, inefficient energy use, and signal degradation due to varied distances between testing interfaces and memory devices, leading to non-uniform temperature control and potential thermal damage.
Innovation Solution
A thermal conduction-based testing system using a cartridge with memory devices that thermally couple with heater boards through pressure changes, employing a vacuum to move test boards and cartridges towards the heater boards, combined with fluid-filled cooling plates for uniform temperature regulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If convection oven-based testing systems are used to test memory devices in high or low temperature environments, then temperature control capability is provided, but large temperature gradients are created leading to non-uniform temperature control and potential thermal damage
Solution Approach 1:
A thermal transfer plate is introduced as an intermediary component between the heat source and the memory devices. The plate is heated to a target temperature and then thermally coupled with the memory devices through a cartridge, providing uniform temperature distribution across all devices without creating large temperature gradients in the testing environment.
Solution Approach 2:
The convection-based thermal system is replaced with a conduction-based thermal system. Instead of using heated air circulation to transfer thermal energy, the system uses direct thermal conduction through the thermal transfer plate and cartridge, eliminating the temperature gradients inherent in convection systems.
2Temperature
If convection oven-based testing systems are used, then temperature control is achieved, but inefficient energy use occurs due to heating large volumes of air
Solution Approach 1:
The unnecessary component (large volume of air) is removed from the thermal transfer process. Instead of heating extensive air volumes, the system extracts and applies only the necessary thermal energy directly to the thermal transfer plate and cartridge, which then conduct heat to the memory devices, dramatically reducing energy consumption.
Solution Approach 2:
Convection-based thermal transfer (heating air) is substituted with conduction-based thermal transfer (direct contact through solid materials). This replacement eliminates the energy waste associated with heating and circulating large volumes of air, as thermal conduction through the plate and cartridge is far more energy-efficient.
3Productivity
If convection oven-based testing systems are used, then testing capability is provided, but signal degradation occurs due to varied distances between testing interfaces and memory devices
Solution Approach 1:
The testing interface and thermal management functions are merged into a single integrated cartridge structure. The cartridge holds the memory devices in precise positions and provides both thermal coupling and electrical testing connections, ensuring uniform distance and optimal signal quality for all devices being tested simultaneously.
Solution Approach 2:
The cartridge structure creates equipotential conditions for all memory devices by maintaining uniform physical spacing and thermal coupling. All devices are positioned at equivalent distances from the testing interface, eliminating signal degradation caused by varied distances and ensuring reliable testing across the entire batch.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves more efficient energy use and uniform temperature control across memory devices, reducing thermal damage and improving yield by minimizing temperature gradients and signal degradation.
Implementation Method 1
reducing a pressure within the housing to move a test board to electrically couple with the cartridge and to apply a force to the cartridge to move the plurality of memory devices to thermally couple with the second thermal plate
Implementation Method 2
thermal conduction based batch testing system
Data Source
AI summary
Methods, systems, and devices for thermal conduction based batch testing system are described. A testing system may include a set of memory devices may arranged on a loading cartridge and placed within the testing system. The testing system may include one or more test boards located in parallel with the memory devices within the testing system. In some cases, the testing system may push the test boards toward the cartridge, causing the memory devices to thermally couple with a heater board. The testing system may include a fluid filled cooling plate thermally coupled with the heater board. In some examples, the testing system may generate a vacuum within a housing containing the test boards and cartridge, which may cause the outside atmosphere to apply a force on the test boards towards the heater board.