Memory Module Case Assembly for Heat Dissipation and EMI Shielding
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Solution Overview
Problem
Existing semiconductor devices face challenges in managing heat dissipation and electromagnetic/electrostatic discharge (EMI/ESD) noise, particularly as data processing speeds increase, which can lead to performance degradation and manufacturing cost increases.
Innovation Solution
A semiconductor device design featuring a first case with a heat dissipation chamber assembly, including a heat diffusion chamber and sidewall structure, which uses a heat transfer fluid for efficient heat dissipation and grounds the sidewall structure to shield electronic components from EMI/ESD noise, while maintaining a sealed structure to prevent cost escalation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If data processing speed of SSD device is increased, then input and output data speed is improved, but heat dissipation performance deteriorates and EMI/ESD noise increases
Solution Approach 1:
The case structure is segmented into multiple functional zones: a heat dissipation chamber assembly with vapor chamber for heat management, and a separate shielding structure with ground pattern for EMI/ESD protection. This segmentation allows each component to optimize its specific function without interfering with the other, resolving the contradiction between high-speed data processing and heat dissipation performance.
Solution Approach 2:
A vapor chamber is introduced as an intermediary heat transfer mechanism between the electronic components and the external environment. The vapor chamber acts as a mediator that efficiently transports heat away from high-performance components, enabling sustained high-speed data processing without overheating.
2Speed
If data processing speed of SSD device is increased, then input and output data speed is improved, but EMI/ESD noise shielding requirement increases
Solution Approach 1:
The case structure is segmented into multiple functional zones: a heat dissipation chamber assembly with vapor chamber for heat management, and a separate shielding structure with ground pattern for EMI/ESD protection. This segmentation allows each component to optimize its specific function without interfering with the other, resolving the contradiction between high-speed data processing and heat dissipation performance.
Solution Approach 2:
A vapor chamber is introduced as an intermediary heat transfer mechanism between the electronic components and the external environment. The vapor chamber acts as a mediator that efficiently transports heat away from high-performance components, enabling sustained high-speed data processing without overheating.
3Temperature
If heat dissipation chamber assembly and sidewall structure are added, then heat dissipation and EMI/ESD shielding performance is improved, but device complexity increases
Solution Approach 1:
The heat dissipation chamber assembly and sidewall structure are merged into a single integrated component that forms part of the case structure. This merging reduces the number of separate parts and assembly steps, thereby reducing device complexity while maintaining effective heat dissipation and EMI/ESD shielding functionality.
Solution Approach 2:
The case structure is designed to perform multiple functions simultaneously: mechanical protection, heat dissipation through the vapor chamber, and EMI/ESD shielding through the ground pattern. This multi-functionality reduces the need for separate dedicated components, thereby reducing overall device complexity.
4Temperature
If heat dissipation chamber assembly and sidewall structure are added, then heat dissipation and EMI/ESD shielding performance is improved, but manufacturing cost increases
Solution Approach 1:
The heat dissipation chamber assembly and sidewall structure are merged into a single integrated component that forms part of the case structure. This merging reduces the number of separate parts and assembly steps, thereby reducing device complexity while maintaining effective heat dissipation and EMI/ESD shielding functionality.
Solution Approach 2:
The case structure is designed to perform multiple functions simultaneously: mechanical protection, heat dissipation through the vapor chamber, and EMI/ESD shielding through the ground pattern. This multi-functionality reduces the need for separate dedicated components, thereby reducing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances heat dissipation performance and shields electronic components from EMI/ESD noise, maintaining a sealed structure without increasing manufacturing costs.
Implementation Method 1
the heat diffusion chamber may use a heat transfer fluid, such as vapor, to dissipate heat from the electronic component to the outside
Implementation Method 2
a heat diffusion chamber in thermal contact with the least one electronic component
Data Source
AI summary
A semiconductor device includes a first case, a second case coupled to the first case to form an inner space, a memory module disposed within the inner space, and including a module substrate and a plurality of electronic components mounted on the module substrate, and a heat dissipation chamber assembly provided in at least a portion of the first case, and including a heat diffusion chamber in thermal contact with at least one of the electronic components and a sidewall structure extending vertically toward the module substrate to surround the electronic component in thermal contact with the heat diffusion chamber.