Semiconductor Memory Casing with Spacer for Multi-Standard Connector Compatibility

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Solution Overview

Problem

The varying sizes and shapes of connectors for semiconductor memory devices, such as USB Type-A and USB Type-C, require distinct casing designs, leading to increased manufacturing costs and design complexity due to the need for individualized mold production for each standard.

Innovation Solution

A semiconductor memory device design that includes a casing with a spacer interposed between the connector and the casing edge, allowing a USB Type-C connector to pass through a USB Type-A sized opening, enabling shared use of the casing for different connector standards by stabilizing the connector with the spacer and restricting movement.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the casing is designed with a specific opening size and shape for a particular connector standard, then the connector is properly held and stabilized, but the casing cannot accommodate other connector standards, requiring individualized mold production for each standard

Engineering Contradiction:
Improvecompatibility with different connector standardsVSAvoidcasing design complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The casing is divided into two functional parts: a standardized opening structure (first edge) that accommodates multiple connector types, and a connector-specific holding structure (second edge with interposition member) that stabilizes the particular connector. This segmentation allows the opening to remain universal while the holding mechanism adapts to specific connector standards.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

An interposition member is introduced as an intermediary element between the casing and the connector. This spacer or positioning component enables the connector to be held at the correct position without requiring the casing opening to be custom-designed for each connector standard, thus facilitating compatibility across different standards.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of manufacture

If individualized mold production is performed for each connector standard, then the connector is properly accommodated, but manufacturing costs and design evaluation periods increase

Engineering Contradiction:
Improvemold manufacturing costVSAvoidconnector standard compatibility
Core Design Contradiction:
Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The casing opening structure is designed with universal functionality to accommodate multiple connector standards (USB Type-A, USB Type-C, etc.) through a single mold. The standardized first edge and flexible second edge configuration allow one casing design to serve multiple purposes, eliminating the need for separate molds for each connector standard.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Adaptability or versatility

If the connector passes through the casing opening away from the edge, then the connector can be accommodated in non-standard positions, but the connector stability and positioning accuracy deteriorate

Engineering Contradiction:
Improveconnector positioning flexibilityVSAvoidconnector positioning accuracy
Core Design Contradiction:
Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The interposition member acts as a mediator that compensates for the distance between the connector and the casing edge. By providing a positioning reference and physical support at the correct location, the interposition member ensures accurate connector positioning even when the connector is placed away from the casing edge for compatibility reasons.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS20190288468A1Semiconductor memory device
Publication Date: 2019.09.19 KIOXIA CORP
  • US20190288468A1 patent drawing
  • US20190288468A1 patent drawing
  • US20190288468A1 patent drawing

AI summary

According to one embodiment, a semiconductor memory device includes a casing, a substrate, a second connector, and an interposition member. The casing is provided with a first opening and includes a first edge forming the first opening. A first connector conforms to USB Type-A standard and can pass through the first opening. The interposition member is interposed between an inner surface of the casing and the second connector, is held by the inner surface, and holds the second connector.