Memory Test Chamber Airflow Control for Uniform Device Temperature
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Solution Overview
Problem
Aging tests for memory devices like SSDs require consistent temperature conditions, but existing systems struggle to maintain uniform temperature due to varying heating values during read and write tests, leading to unreliable results.
Innovation Solution
A test system with a temperature adjusting apparatus and air spray nozzles that circulate air within a chamber to control temperature and improve heat convection, using temperature sensors to detect and compensate for temperature differences between memory devices and a target temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If memory devices are tested with read and write test programs, then test functionality is verified, but temperature varies due to different heating values causing unreliable test results
Solution Approach 1:
The patent implements a feedback control system where temperature sensors continuously monitor the temperature of each memory device during testing, and the controller adjusts the heating power of individual heating elements accordingly. This closed-loop feedback mechanism compensates for temperature variations caused by different test programs, ensuring consistent test conditions and reliable results.
Solution Approach 2:
The patent employs individual heating elements and temperature sensors for each memory device socket, allowing independent temperature control and compensation for each device. This localized approach enables precise temperature management despite varying heating characteristics of different memory devices or test programs.
2Temperature
If temperature is controlled using conventional methods, then energy consumption is reduced, but temperature differences between memory devices and target temperature persist
Solution Approach 1:
The patent dynamically adjusts the heating power parameters of individual heating elements based on real-time temperature feedback from sensors. By changing the heating power parameter adaptively rather than using fixed high-power heating, the system maintains target temperature with minimal energy consumption while compensating for temperature differences.
3Productivity
If multiple test sockets are used to increase testing capacity, then productivity improves, but temperature uniformity across all sockets becomes difficult to maintain
Solution Approach 1:
The patent divides the test chamber into independently controllable zones, with each test socket having its own heating element and temperature sensor. This segmentation allows each socket to be controlled individually, maintaining temperature uniformity across multiple sockets simultaneously while maximizing testing capacity.
Solution Approach 2:
Each test socket is equipped with localized temperature control components (heating element and sensor), enabling independent temperature management for each socket. This local quality approach ensures that temperature uniformity is maintained across all sockets regardless of their position or the number of devices being tested.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures reliable test results by maintaining memory devices at a consistent target temperature, reducing temperature differences and improving heat convection uniformity within the chamber.
Implementation Method 1
a temperature adjusting apparatus configured to supply air into the chamber according to a temperature control signal to control a temperature of the chamber
Implementation Method 2
at least one air spray nozzle extending in the first direction at a side of the at least one test socket column and having a plurality of spray holes along the first direction and configured to spray a second air toward the memory devices
Data Source
AI summary
A test system for a memory device includes: a chamber including at least one test socket column having a plurality of test sockets arranged in a first direction, wherein memory devices to be tested are in respective ones of the plurality of test sockets, a temperature adjusting apparatus configured to supply air into the chamber according to a temperature control signal to control a temperature of the chamber, a test device electrically connected to the test sockets and configured to test the memory devices, and a temperature controller configured to receive temperature information of the memory devices from temperature sensors of the memory devices and to output to the temperature adjusting apparatus the temperature control signal to compensate for a temperature difference between a detected temperature of the memory devices and a target temperature.


