Semiconductor Memory Chip Pad Arrangement for Routing Simplification
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Solution Overview
Problem
The increasing demand for portable electronic devices with multiple processors or multicore systems complicates the wiring structure of semiconductor packages, leading to decreased routability and package performance due to the need for efficient interconnection between memory and logic chips.
Innovation Solution
A semiconductor package design featuring memory chips with data pads and command/address pads arranged on opposite sides, connected to a package substrate with CA connection pads, which simplifies the interconnection structure by reducing signal delivery distance and interference, thereby improving signal processing speed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple semiconductor chips are stacked in a package with typical wiring structure, then the package can provide multiple processors or multicore system functions, but the wiring structure becomes complicated and routability decreases
Solution Approach 1:
The patent transitions from planar pad arrangement to three-dimensional opposite-side arrangement. Command/address pads are positioned on one opposite side of the chip while data pads are on the other opposite side, creating a vertical separation of signal types that simplifies routing in stacked packages and reduces wiring complexity among multiple chips.
Solution Approach 2:
The patent segments the pad functions by spatially separating command/address pads from data pads on opposite sides of the chip. This segmentation allows independent routing paths for control signals and data signals, reducing interference and simplifying the overall wiring structure in multi-chip packages.
2Ease of operation
If command/address pads and data pads are arranged on the same side of the chip, then routing is simpler, but signal interference increases and processing speed decreases
Solution Approach 1:
The patent uses spatial separation in the vertical dimension by placing command/address pads on one opposite side and data pads on the other opposite side. This dimensional separation physically isolates control signals from data signals, eliminating interference while maintaining routing efficiency through the package substrate.
3Adaptability or versatility
If semiconductor chips are electrically connected within one package, then system integration is achieved, but the wiring structure becomes complicated
Solution Approach 1:
The patent enables simplified three-dimensional interconnection by positioning command/address pads on one opposite side and data pads on the other. This arrangement allows separate routing layers in the package substrate to connect corresponding pads on stacked chips, reducing the complexity of inter-chip wiring while achieving system integration.
Data Source
AI summary
Provided are semiconductor memory chips and semiconductor packages with the same. The semiconductor package may include a memory chip including first data pads and first command/address pads arranged adjacent to a first side region thereof and second data pads and second command/address pads arranged adjacent to a second side region thereof arranged opposite to the first side region, and a package substrate including first CA connection pads and second CA connection pads. The memory chip may be mounted on a top surface of the package substrate, the first CA connection pads may be connected to the first command/address pads, and the second CA connection pads may be provide to be opposite to the first CA connection pads and be connected to the second command/address pads.