Memory Module Compression Connection Eliminates Solder Thermal Stress
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Solution Overview
Problem
Existing memory modules face challenges in achieving high density and capacity while maintaining a small package size, and traditional solder adhesion methods are prone to thermal expansion issues and increased production costs.
Innovation Solution
A memory module design featuring a mounting substrate with substrate pads, semiconductor packages with external connection terminals, and a connection member composed of conductive terminals and an insulating rubber plate, which is compressed by a pressure fixing member to establish electrical connections without the need for solder adhesion, allowing for stacked semiconductor packages and reduced production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder adhesion is used to electrically connect substrate pad and external interconnection of semiconductor package, then electrical connection is established, but thermal expansion issues occur and production costs increase
Solution Approach 1:
The patent introduces a connection member as an intermediary component between the substrate pad and external interconnection terminal. This connection member includes a connection terminal that electrically connects to the external interconnection terminal, eliminating the need for direct solder adhesion between the substrate pad and external interconnection, thereby resolving thermal expansion issues while maintaining reliable electrical connection.
2Quantity of substance
If semiconductor packages are stacked to achieve high density and capacity, then memory capacity increases, but package size reduction becomes more challenging
Solution Approach 1:
The patent transitions from two-dimensional planar arrangement to three-dimensional stacked arrangement of semiconductor packages. By stacking multiple semiconductor packages vertically on the substrate, the memory capacity is significantly increased while the footprint area remains compact, effectively utilizing the vertical dimension to achieve high density.
Solution Approach 2:
The patent implements a nested structure where multiple semiconductor packages are stacked and interconnected through connection members. Each semiconductor package contains memory chips nested within a package structure, and multiple such packages are nested vertically, creating a compact high-capacity memory module.
3Ease of manufacture
If connection member is compressed by pressure fixing member, then electrical connection is established without solder adhesion, but additional components are required
Solution Approach 1:
The patent replaces the traditional thermal-mechanical soldering process with a mechanical compression system. A pressure fixing member applies compressive force to the connection member, establishing electrical connection through mechanical pressure rather than thermal adhesion, thereby eliminating solder-related thermal expansion issues and simplifying the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the reliability and reduces the production costs of memory modules by eliminating solder adhesion-related issues and enabling high-density, high-capacity memory systems with improved thermal management.
Implementation Method 1
a pressure fixing member compressing the connection member to electrically connect the external connection terminals and the substrate pads by the medium of the connection terminals
Data Source
AI summary
Provided is a memory module. The memory module may include a mounting substrate including a plurality of first substrate pads disposed on a top surface of the mounting substrate, a first semiconductor package disposed on a top surface of the mounting substrate, the first semiconductor package having a first frame and first external connection terminals which extend through the outside of the first frame and are disposed on the first substrate pads, a first connection member including first connection terminals disposed between the first external connection terminals and the first substrate pads and a pressure fixing member compressing the first connection member to electrically connect the first external connection terminals and the first substrate pads by the medium of the first connection terminals.