Solid State Memory Conductive Structure Periphery Contact
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Solution Overview
Problem
The conventional process for forming electrical connections in vertical memory arrays is complex and leads to manufacturing difficulties such as planarization, topography, and dishing issues, impacting yield and costs due to the need for bulk removal of conductive and insulative materials in the periphery regions.
Innovation Solution
A simplified process where conductive and insulative layers remain substantially intact in the periphery, with contacts extending through these layers to interconnects, reducing material removal and using insulative liners to isolate contacts from conductive layers, thereby minimizing manufacturing issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bulk removal of conductive and insulative materials is performed in the periphery to form electrical connections, then electrical connections with interconnects can be established, but manufacturing complexity increases and planarization/dishing issues occur
Solution Approach 1:
The conductive and insulative layers are extended into the periphery regions in advance, before the need to form electrical connections. This preliminary extension eliminates the requirement for bulk material removal later, as the layers are already positioned to facilitate direct contact with interconnects, thereby simplifying the manufacturing process while ensuring reliable electrical connections
Solution Approach 2:
The invention extracts and removes the problematic bulk material removal step from the manufacturing process. By extending the layers into the periphery beforehand, the need to perform large-scale material removal and subsequent planarization is eliminated, keeping only the essential steps of forming contacts through the extended layers
2Reliability
If bulk removal of conductive and insulative materials is performed in the periphery, then electrical connections can be formed, but manufacturing yield decreases due to planarization and dishing issues
Solution Approach 1:
The conductive and insulative layers are extended into the periphery regions in advance, before the need to form electrical connections. This preliminary extension eliminates the requirement for bulk material removal later, as the layers are already positioned to facilitate direct contact with interconnects, thereby simplifying the manufacturing process while ensuring reliable electrical connections
Solution Approach 2:
The invention converts the potential harm of having excess material in the periphery into a benefit. Instead of viewing the extended layers as waste material requiring removal, the solution utilizes these extended layers directly to form the electrical connections, turning what would be a manufacturing burden into a functional advantage that improves yield
3Ease of operation
If conductive and insulative layers are removed in bulk from the periphery, then interconnect access is achieved, but manufacturing costs increase
Solution Approach 1:
The conductive and insulative layers are extended into the periphery regions in advance, before the need to form electrical connections. This preliminary extension eliminates the requirement for bulk material removal later, as the layers are already positioned to facilitate direct contact with interconnects, thereby simplifying the manufacturing process while ensuring reliable electrical connections
Data Source
AI summary
Conductive structure technology is disclosed. In one example, a conductive structure can include an interconnect and a plurality of conductive layers overlying the interconnect. Each conductive layer can be separated from an adjacent conductive layer by an insulative layer. In addition, the conductive structure can include a contact extending through the plurality of conductive layers to the interconnect. The contact can be electrically coupled to the interconnect and insulated from the plurality of conductive layers. Associated systems and methods are also disclosed.