Dynamic Memory Configuration via Dummy Modules and Connector Segmentation

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Solution Overview

Problem

Users of semiconductor memory systems face challenges in dynamically changing the configuration of memory modules to achieve desired capacity, as existing systems lack flexibility in accommodating varying memory needs.

Innovation Solution

The memory system employs a configuration where connectors on a system board connect memory modules and a memory controller through channels, allowing for the installation of dummy modules and multiple memory modules to adjust capacity, with termination resistors improving signal integrity and enabling selective use of lower or higher capacity configurations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If memory modules are fixed in configuration, then system stability is improved, but adaptability deteriorates

Engineering Contradiction:
Improvesystem stabilityVSAvoidmemory configuration flexibility
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent implements dynamic memory configuration by enabling users to install memory modules in different connector positions (first connector alone, or first and second connectors combined) to change memory capacity. The system dynamically adapts to different memory configurations through automatic detection and configuration by the memory controller, resolving the contradiction between fixed stability and flexible adaptability.

Inventive Principle:
Principle #15Dynamics

2Productivity

If memory capacity is increased, then performance is improved, but device complexity deteriorates

Engineering Contradiction:
Improvememory capacityVSAvoidconnector configuration complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent segments the memory system into multiple independent connectors (first connector and second connector) that can be independently configured. Users can increase memory capacity by adding modules to the second connector while keeping the first connector active, or use only the first connector for lower capacity. This segmentation allows capacity expansion without proportionally increasing system complexity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The memory controller is designed with multi-functionality to handle different connector configurations universally. It can automatically detect and support various configurations (first connector only, or both first and second connectors), allowing the system to accommodate different memory capacities without requiring complex manual configuration or additional control logic.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Reliability

If dummy memory modules are used, then signal integrity is improved, but device complexity deteriorates

Engineering Contradiction:
Improvesignal integrityVSAvoidmodule installation complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent employs dummy memory modules as simple, inexpensive components to maintain signal integrity when memory slots are not fully utilized. These dummy modules are basic components without complex functionality, serving solely to provide proper electrical termination and signal reference levels, thus improving signal integrity while adding minimal complexity to the system.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Data Source

PatentUS7539035B2Memory system capable of changing configuration of memory modules
Publication Date: 2009.05.26 SAMSUNG ELECTRONICS CO LTD
  • US7539035B2 patent drawing
  • US7539035B2 patent drawing
  • US7539035B2 patent drawing

AI summary

A memory system is disclosed with first, second, and third connectors located on a system board, the third connector including pins connected to the pins of the first and second connectors through channels, and a memory controller connected to the pins of the third connector through channels. The memory system, as configured in a first memory capacity, comprises; dummy memory modules and a first memory module connected to the memory controller by installing the dummy memory modules in the first and second connectors and installing the first memory module in the third connector. The memory system, as alternately configured in a second memory capacity larger than the first memory capacity, comprises second memory modules connected to the memory controller by installing the second memory modules in only the first and second connectors.