Modular Memory Connector Bridge for High-Speed Replaceable Substrates
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Solution Overview
Problem
Current package assemblies for mobile electronic devices face challenges in reducing size while maintaining performance, particularly in the integration of memory modules, which often require disassembly for memory replacement and can suffer from mechanical stress and structural integrity issues due to direct coupling methods like ball grid arrays.
Innovation Solution
A modular memory package system using a connector bridge with parallel leads that electrically and mechanically couple substrates, allowing for scalable high-speed memory connections without direct substrate coupling, enabling easy memory module replacement and improved structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If direct substrate coupling methods like ball grid arrays are used, then electrical connection is achieved, but mechanical stress and structural integrity issues occur
Solution Approach 1:
The patent divides the coupling function into separate components: a connector with electrical contacts and a separate coupling mechanism. This segmentation allows the electrical connection to be made through the connector while the mechanical stress is handled by the coupling mechanism, preventing stress transmission to the substrates and maintaining structural integrity.
Solution Approach 2:
The connector acts as an intermediary element between the two substrates. It provides electrical contacts for signal transmission while being mechanically coupled to the substrates in a way that isolates them from each other's mechanical stress, thus serving as a mediator that handles both electrical and mechanical functions separately.
2Volume of moving object
If memory modules are directly integrated, then device size is reduced, but memory replacement requires disassembly
Solution Approach 1:
The memory module is designed as a separate, removable component that couples to the substrate through the connector. This segmentation allows the memory module to be independently removed and replaced without disassembling the entire device, while still maintaining a compact integrated appearance during normal operation.
Solution Approach 2:
The coupling mechanism incorporates movable components such as latches or clips that can be easily actuated to release the memory module. This dynamic coupling allows the memory module to be securely held during operation but easily removed when needed, providing both compact integration and repairability.
3Adaptability or versatility
If modular memory packages are used, then memory scalability is improved, but connection speed may be reduced
Solution Approach 1:
The connector is designed with electrical contacts that provide direct electrical pathways between the memory module and substrate. This intermediary structure minimizes the length and complexity of signal paths, allowing high-speed DDR connections to be maintained even though the memory module is a separate removable component, thus preserving connection speed while enabling scalability.
Data Source
AI summary
Embodiments herein relate to systems, apparatuses, or processes for a connector for a modular memory package that includes one or more memory dies on a substrate, where the connector directly electrically couples electrical contacts at an edge and on each side the substrate of the memory package to electrical contacts at an edge and on each side of another substrate that includes a compute die. The connector may include a first plurality of leads that are substantially parallel with each other, and a second plurality of leads that are substantially parallel with each other that are below the first plurality of leads and electrically couple the two substrates. Other embodiments may be described and/or claimed.