Memory Device Contact Plug Merging for Manufacturing Simplicity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current memory devices face challenges in miniaturization and cost reduction due to complex interconnection structures and large contact hole sizes, which complicate manufacturing and increase costs.
Innovation Solution
A memory device design featuring a conductive member with stacked interconnections, contact plugs, and insulating members, where a single contact plug connects both the electrode film and lower layer interconnection, eliminating the need for an upper layer interconnection and allowing for larger contact hole diameters, thus simplifying the manufacturing process and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a single contact plug is used to connect both the electrode film and lower layer interconnection, then the manufacturing process is simplified and costs are reduced, but the contact hole size must be larger which increases the occupied area
Solution Approach 1:
The patent merges the functions of two separate contact plugs into a single contact plug that simultaneously connects to both the electrode film and the lower layer interconnection. This consolidation eliminates the need for an upper layer interconnection and simplifies the manufacturing process, directly resolving the technical contradiction by prioritizing ease of manufacture over minimal contact hole area.
2Ease of manufacture
If the contact hole diameter is increased to facilitate manufacturing, then the manufacturing process is simplified, but the occupied area increases which prevents miniaturization
Solution Approach 1:
The patent transitions from a two-dimensional planar connection structure to a three-dimensional stacked structure. By stacking the interconnections vertically and using a single contact plug to access multiple layers, the design enables larger contact holes without proportionally increasing the footprint area, thus facilitating miniaturization in the planar dimension while maintaining manufacturing ease.
3Reliability
If multiple interconnection layers are used to connect contact plugs, then the connection reliability is improved, but the device complexity and manufacturing cost increase
Solution Approach 1:
The patent combines multiple connection functions into a single contact plug structure that simultaneously establishes electrical connections to both the electrode film and the lower layer interconnection. This merging approach maintains connection reliability by ensuring proper electrical pathways while significantly reducing the overall interconnection structure complexity and manufacturing cost.
Solution Approach 2:
The single contact plug serves multiple functions: it connects to the electrode film, connects to the lower layer interconnection, and eliminates the need for a separate upper layer interconnection. This multi-functionality approach maintains necessary connection reliability while reducing device complexity and manufacturing overhead.
Data Source
AI summary
According to one embodiment, a memory device includes a conductive member and a stacked body provided on the conductive member. The stacked body includes a plurality of first interconnections being stacked to be separated from each other, a memory cell connected with one of the first interconnections, a plurality of contact plugs, an insulating member. Each of the contact plugs connects each of the first interconnections with an upper surface of the conductive member. One of the contact plugs includes an upper part, and a lower part. The lower part is provided between the upper part and the conductive member. The lower part includes a first portion and a second portion. The first portion is connected with one of the first interconnections. The second portion is connected with the conductive member. The insulating member is provided between the first portion and the second portion.